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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/industries/electronics-assembly-and-packaging?page=29
% smaller form factor. Nordson EFD X-ray Inspection Criteria & Common Defect Analysis The definitive guide to understanding electronics manufacturing defects using X-ray inspection is back for a second edition
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& Common Defect Analysis Nordson DAGE The definitive guide to understanding electronics manufacturing defects using X-ray inspection is back for a second edition
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& Common Defect Analysis Nordson DAGE The definitive guide to understanding electronics manufacturing defects using X-ray inspection is back for a second edition
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. ACOUSTIC IMPEDANCE POLARITY DETECTOR (AIPD)™ Delivers the most accurate defect detection, and reliably detects delaminations as thin as 200 Angstroms
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) was used to enable secondary use of the FACTS2 tray image for analysis. Result Ultrasonic reflections of medium intensity from the gated depth are imaged in gray
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Image Capture System Datasheet Nordson DAGE Non-Destructive Techniques for Identifying Defect in BGA Joints: TDR, 2DX and Cross-section/SEM Comparison Nordson DAGE Explorer one Brochure v5c web Nordson DAGE Selection Criteria for X-ray Inspection Systems for BGA and CSP Solder Joint Analysis Nordson DAGE
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. Download the application note Products Content Your results for: Fatigue Testing Non-Destructive Techniques for Identifying Defect in BGA Joints