Partner Websites: dielectric (Page 1 of 13)

Difference PROHIBIT_VIA_HOLE and PROHIBIT_VIA - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2815&OB=ASC.html

: - Via Keepout: prevents a via being placed on that layer. - Via Hole Keepout: allows a via to be stop on that layer, but prevents it passing through the dielectric layer below that layer

PCB Libraries, Inc.

Nomex Type 410

ORION Industries | http://orionindustries.com/pdfs/nomex410.pdf

Nomex Type 410 risk of partial discharges (corona). The Full Wave Impulse dielectric strength data of Table I were generated on flat sheets, such as in layer and barrier applications

ORION Industries

Thermal Compound Dictionary | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/thermal-compound-glossary

) has the minimum thermal resistance. Thermal resistance will not change at thickness less than this value.     C   D Dielectric Constant A measure of a substance's ability to insulate charges from each other

ASYMTEK Products | Nordson Electronics Solutions

Mylar Polyester Film Type EL-21 750-1400 Gauge

ORION Industries | http://orionindustries.com/pdfs/mylarel21.pdf

. The excellent dielectric strength, moisture resistance, and physical toughness make Mylar® a very versatile and functional insulating material

ORION Industries

Thermal Compound Dictionary | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/thermal-compound-dictionary

) has the minimum thermal resistance. Thermal resistance will not change at thickness less than this value.     C   D Dielectric Constant A measure of a substance's ability to insulate charges from each other

ASYMTEK Products | Nordson Electronics Solutions

Gap Pad? 1500

ORION Industries | http://orionindustries.com/pdfs/SILPADA2000.pdf

. SPA-2000 is for applications where optimal heat transfer is a requirement. This thermally conductive silicone elastomer is formulated to maximize the thermal and dielectric performance of the filler/binder matrix. The result is a “grease-free

ORION Industries

Which PCB Substrate Should I Use? | Imagineering, Inc.

Imagineering, Inc. | https://www.pcbnet.com/blog/pcb-substrate/

. Coating the core is prepreg , a dielectric material binding agent that covers the core. An outer layer of foil is attached to the surface, forming the surface area which component parts will be attached and traces will be etched

Imagineering, Inc.

What are Aluminum Printed Circuit Boards Used For? | Imagineering, Inc.

Imagineering, Inc. | https://www.pcbnet.com/blog/what-are-aluminum-printed-circuit-boards-used-for/

–  The circuit layer in an aluminum PCB is made using copper foil. Typically, this layer is slightly thicker than a standard circuit board, allowing the board to carry a larger current. Dielectric Layer

Imagineering, Inc.

FORMEX GK/FORMEX FLAME RETARDANT POLYPROPYLENE DATA SHEET

ORION Industries | http://orionindustries.com/pdfs/formex.pdf

˚F MECHANICAL WITHOUT IMPACT 95˚C/203˚F 105˚C/221˚F 115˚C/239˚F 115˚C/239˚F 115˚C/239˚F ELECTRICAL PROPERTIES DIELECTRIC BREAKDOWN-VO LTS ASTM D-149 18,000 22,000 24,820 32,400 37,800 DIELECTRIC STRENGTH-VOLTS/MIL ASTM D-149 1800 2200 1460 1080 945 VOLUME RESISTIVITY-OHM-CM ASTM D-257 146 x 1015 3.97 x 1015 3.97 x 1015 3.97 x 1015

ORION Industries

FR-4 vs. Rogers Material for Manufacturing RF PCBs | Imagineering, Inc.

Imagineering, Inc. | https://www.pcbnet.com/blog/fr-4-vs-rogers-material-for-manufacturing-rf-pcbs/

. Dielectric Constant (Dk) The dielectric constant is a material’s ability to store electrical energy in electric fields, depending on its direction with the axis

Imagineering, Inc.

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