PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipc-standards-for-manufacturing-assembly_topic877_post7624.html
Frequency Applications IPC-4104 - Specification for Base Materials for High Density Interconnect (HDI) and Microvia Materials IPC-4202 - Flexible Base Dielectrics for Use in Flexible Printed Circuitry IPC-4203 - Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/applications-corner/4-expert-setup-tips-1k-tim-application
. Protect the Heat Conducting Performance of Your Material Incorporating a thermal gap filler into your design means you’ve invested a significant amount of time considering the mechanical requirements, dielectric strength, package size, environmental conditions and limitations, and of course, how much heat to dissipate
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic877&OB=ASC.html
Frequency Applications IPC-4104 - Specification for Base Materials for High Density Interconnect (HDI) and Microvia Materials IPC-4202 - Flexible Base Dielectrics for Use in Flexible Printed Circuitry IPC-4203 - Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc-standards-for-manufacturing-assembly_topic877_post3186.html
Frequency Applications IPC-4104 - Specification for Base Materials for High Density Interconnect (HDI) and Microvia Materials IPC-4202 - Flexible Base Dielectrics for Use in Flexible Printed Circuitry IPC-4203 - Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry
56118 | https://www.whizzsystems.com/wp-content/uploads/2021/02/ORU-Whizz-Whitepaper_Rev6_Nov05-2020_QQS.pdf
Whizz Systems
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/industries/defense?page=14
. Nordson SEALANT EQUIPMENT RIE System Nordson MARCH's RIE-1701 Plasma System is designed for advanced etching applications such as: removal of interlayer films for failure analysis, de-encapsulation and dielectric material removal
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/industries/mems?con=t
MARCH's RIE-1701 Plasma System is designed for advanced etching applications such as: removal of interlayer films for failure analysis, de-encapsulation and dielectric material removal
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/plasma-applications/plasma-prior-to-conformal-coating
that requires low dielectric constant (DK) materials, primarily PTFE, which have poor adhesion rates The use of Ni/Pd/Au leads, which can corrode in humid environments and have “knees
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/industries/electronics-semiconductor?con=t&page=33
: removal of interlayer films for failure analysis, de-encapsulation and dielectric material removal,… Medical Nordson MARCH Nordson MARCH provides innovative plasma processes and equipment to meet specific application requirements of the medical device manufacturing industry
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/industries/aerospace?page=20
: removal of interlayer films for failure analysis, de-encapsulation and dielectric material removal,… Nordson MARCH SC-400 PreciseCoat Jet Nordson ASYMTEK's SC-400 PreciseCoat®
