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| http://etasmt.com/cc?ID=te_news_industry,26961&url=_print
. And our epoxy resin and BT are all organic materials. 2. Inorganic materials: ① Aluminum substrate: The aluminum substrate is a metal-based copper clad laminate with good heat dissipation function
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. Why Use A Vacuum In Reflow Soldering? There are five ways to eliminate voids that will improve product performance. 1. Improve heat dissipation of components or solder joint structures (i.e
Imagineering, Inc. | https://www.pcbnet.com/blog/high-temperature-pcb-considerations-for-high-heat-applications/
. Thermal management for proper heat control can also strongly influence cost, weight, size, and power requirements. PCB Heat Dissipation The two primary methods of removing heat from a circuit board are convection and conduction
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/markets-and-industries/pcb-and-smt-assembly
. Heat Dissipation for Hot Components Many high-speed processors, AMPs and converters/inverters need efficient heat dissipation. Thermal interface material (TIM
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1066-voids-in-solder
) are large and small voids in the solder. Since heat dissipation is critical in rectifiers, the reduction in heat-sink efficiency by these voids is significant
