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Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys
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components 03047282-02 Crash light barrier high components 03047283-02 Bero Waffle Pack Tray Carrier available 03047285-02 Bero anti-twist device magazine carrier 03047293-01 Cylindrical magnet d
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KD Electronics Ltd. | http://www.kundasmt.com/?ASM/6010.html
- magnet valve / V114A-5MOU 03085513S01 stiffener guide rail-buffer left SX4 03085517S02 dummy splice sensor X12/X16 V2 03085518-01 Add-on kit COT-I 30 CAN-Switch 2