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How to prevent static electricity during the operation of the Full-auto SMT Production Line? - Dongguan Intercontinental Technology Co.,Ltd. English Türk dili Tiếng Việt 한국어 日本語
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. In addition to the edge conveyor a centre-board-support is usually included to stop the PCB from sagging during the reflow process – see below
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. In addition to the edge conveyor a centre-board-support is usually included to stop the PCB from sagging during the reflow process – see below
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. In addition to the edge conveyor a centre-board-support is usually included to stop the PCB from sagging during the reflow process – see below
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. Does the slurry require a nitrogen (low oxygen) environment during heating? Reflow specifications, including peak temperature, time above liquidus (TAL), etc
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. Controlled tin flow direction; 5. The soldering surface does not move during reflow soldering. 1. Appropriate heat. Appropriate heat means that for the reflow soldering materials, there must be enough thermal energy to melt them and form an intermetallic interface (IMC
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. Does the slurry require a nitrogen (low oxygen) environment during heating? Reflow specifications, including peak temperature, time above liquidus (TAL), etc
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