| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-wire-bond-failing-pull-test
. For beam lead devices: (d-1) Silicon broken. (d-2) Beam lifting on silicon. (d-3) Beam broken at bond. (d-4) Beam broken at edge of silicon. (d-5
| https://www.eptac.com/ask/gold-wire-bond-failing-pull-test/
. For beam lead devices: (d-1) Silicon broken. (d-2) Beam lifting on silicon. (d-3) Beam broken at bond. (d-4) Beam broken at edge of silicon. (d-5
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EB 60 Flex Edge Banding Applicators For PUR & EVA Adhesive Application | Nordson Adhesive Dispensing Systems Adhesive Dispensing Systems Corporate | Global Directory
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Nordson Edge Banding Systems High-quality PUR and EVA Adhesive Bonds on Boards & Panels | Nordson Adhesive Dispensing Systems Adhesive Dispensing Systems Corporate | Global Directory
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. Controlled adhesive fiber deposition in a cross-web direction improves bond performance. Produce high-loft tissue and towels with softness of hand and no visible adhesive residue
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nonwoven disposable hygiene product manufacturing, heavier at the ends for high bond strength and a lighter stabilizing bond in the center to retain retractive force
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fiber deposition in a cross-web direction to improve bond performance EF 60 V Edge Filling and Edge Sealing Slot Applicator Adhesive Dispensing Systems Achieve a smooth edge and high-quality finished look
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. Process Air Control Kit Adhesive Dispensing Systems Improves adhesive add-on control and regulates pressure fluctuations to improve bond quality EF 60 V Edge Filling and Edge Sealing Slot Applicator
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. AltaSpray-c: produce high bond strength at low add-on rates in continuous and intermittent operations. control adhesive fiber size, density and pattern width for better bond performance
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fiber deposition in a cross-web direction to improve bond performance New Edge Banding Slot Applicator Increases Edge Banding Flexibility and Productivity - News Release Adhesive Dispensing Systems EB 60
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