16 enig and steam and aging results

SolderTips: Solderability Issues with Nickle Plated Surfaces - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces/

. They will re-tin with flux, but reappear following steam-aging. Is this something you have encountered before? Answer: There is a metallurgy issue with soldering to nickel plated surfaces and depending upon the thickness of the final tin/lead coating, the steam aging will penetrate the finish coating and create a

SolderTips: Solderability Issues with Nickle Plated Surfaces - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces

. They will re-tin with flux, but reappear following steam-aging. Is this something you have encountered before? Answer: There is a metallurgy issue with soldering to nickel plated surfaces and depending upon the thickness of the final tin/lead coating, the steam aging will penetrate the finish coating and create a

SolderTips: Solderability Issues with Nickle Plated Surfaces | EPTAC

| https://www.eptac.com/soldertips/soldertips-solderability-issues-with-nickle-plated-surfaces/

. They will re-tin with flux, but reappear following steam-aging. Is this something you have encountered before? Answer: There is a metallurgy issue with soldering to nickel plated surfaces and depending upon the thickness of the final tin/lead coating, the steam aging will penetrate the finish coating and create a

 The application of flux to the specimen  The flux removal process  Steam aging apparatus  Specimen surface preparation  Dipping methodology 15 Flux Performance

| https://www.eptac.com/wp-content/uploads/2007/10/webinar_eptac_10_17_07.pdf

 The application of flux to the specimen  The flux removal process  Steam aging apparatus  Specimen surface preparation  Dipping methodology 15 Flux Performance

| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_10_17_07.pdf

 Isothermal, to simulate creep failures  Thermal Shock, to simulate mechanical fatigue  Shear Test, to test residual joint strength  Board finishes were OSP and HASL 11 Isothermal Aging

| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_12_17_08.pdf

Soldertips

| https://www.eptac.com/faqs/soldertips?hsLang=en

. They will re-tin with flux, but reappear following steam-aging. Is this something you have encountered before? Read More SolderTips

Soldertips

| https://www.eptac.com/faqs/soldertips

. They will re-tin with flux, but reappear following steam-aging. Is this something you have encountered before? Read More SolderTips

Hearing Aids Electronic Circuitry and Battery Contacts Abhijeet, Yadav, Ph.D., Widex, A/S; Rajan Ambat, Ph.D., Technical University of Denmark Impact of 10-year Room Temperature Aging on SAC105 Deng Yun Chen, Subramani Manoharan, Patrick McClusky, Michael Osterman, CALCE/University of Maryland Mechanical

40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628

Surface Mount Technology Association (SMTA)

40731

Hearing Aids Electronic Circuitry and Battery Contacts Abhijeet, Yadav, Ph.D., Widex, A/S; Rajan Ambat, Ph.D., Technical University of Denmark Impact of 10-year Room Temperature Aging on SAC105 Deng Yun Chen, Subramani Manoharan, Patrick McClusky, Michael Osterman, CALCE/University of Maryland Mechanical

40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200622100619

Surface Mount Technology Association (SMTA)

40731