14 enig bga results

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf

The Last Will And Testament of the BGA Void THE LAST WILL AND TESTAMENT OF THE BGA VOID David Hillman, Dave Adams, Tim Pearson, Brad Williams, Brittany Petrick, and Ross Wilcoxon Rockwell Collins

Heller Industries Inc.

PCB Assembly Technology Roadmap | Imagineering

Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/technology-roadmap/

. Layer Count 50 Max. Working Panel Size 21" x 31" Max. Board Thickness .300" Min. Board Thickness 0.16"(6L) Min. Line/Space • I/L - 2 / 1.5mil (HDI) • O/L - 2 / 1.5 mil (HDI) Warpage .001" / sq. in. BGA Pitch 0.20mm Layer to Layer Registration 3 mil

Imagineering, Inc.

PCB Fabrication Technology Roadmap | Imagineering

Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/technology-roadmap/

. Layer Count 50 Max. Working Panel Size 21" x 31" Max. Board Thickness .300" Min. Board Thickness 0.16"(6L) Min. Line/Space • I/L - 2 / 1.5mil (HDI) • O/L - 2 / 1.5 mil (HDI) Warpage .001" / sq. in. BGA Pitch 0.20mm Layer to Layer Registration 3 mil

Imagineering, Inc.

 Assemblies with all Lead-Free joints and joints with 63/37 BGA ball attached with SAC solder paste on ENIG and processed at 250oC showed very low early failure rate

| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_12_17_08.pdf

” in ENIG and ENEPIG by using “Reduction Assisted Immersion Gold” in place of “Standard Immersion Gold” *George Milad, Jon Bengston and Albin Gruenwald, Uyemura International Corporation Inspection Technologies Refreshment Break Lunch Break Refreshment Break Day One Concludes Women's Leadership Program

40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628

Surface Mount Technology Association (SMTA)

40731

” in ENIG and ENEPIG by using “Reduction Assisted Immersion Gold” in place of “Standard Immersion Gold” *George Milad, Jon Bengston and Albin Gruenwald, Uyemura International Corporation Inspection Technologies Refreshment Break Lunch Break Refreshment Break Day One Concludes Women's Leadership Program

40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200622100619

Surface Mount Technology Association (SMTA)

40731

Journal of SMT Articles

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm

ELECTRONICS ASSEMBLY Alan Rae Abstract 18-2 RELIABILITY ANALYSIS OF SOME CERAMIC LEAD-FREE SOLDER ATTACHMENTS Olli Salmela et al. Abstract 18-2 FLEXURAL STRENGTH OF BGA SOLDER JOINTS WITH ENIG SUBSTRATE FINISH USING 4-POINT BEND TEST Anurag Bansal, Sam Yoon

Surface Mount Technology Association (SMTA)

Solder Dictionary of Terms | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms

.   B Ball Grid Array (BGA) A surface-mount component containing a processor, and sometimes additional components, where the bottom has a grid of connection points with solder balls attached

ASYMTEK Products | Nordson Electronics Solutions

Solder Dictionary of Terms | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms

(e.g. tensile strength, melting temperatures).   Area Array Package A surface-mount component with a grid of connection points on the bottom.   B Ball Grid Array (BGA

ASYMTEK Products | Nordson Electronics Solutions

Surface Mount International

Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc

; this was consistent with work from others [6]. As a result some BGA components on notebook products required partial underfilling (or edge glue

Surface Mount Technology Association (SMTA)