Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf
. The high melting temperature not only requires a new reflow profile, but also increases the component stability concerns accompanying with the higher temperature
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
, Jörg Trodler, Adam Murling Abstract 2018 31-2 Fill The Void III Tony Lentz Abstract 31-2 Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate - Influence of Eigenmodes
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
of TH quantities in large assemblies create a problem with the soldering uniformity. More # of PCB layers, larger internal connections, thicker Cu ground layers and poor Cu balance that in some cases cannot be fix by designers difficult current
Surface Mount Technology Association (SMTA) | https://www.smta.org/webinars/
problem with the soldering uniformity. More # of PCB layers, larger internal connections, thicker Cu ground layers and poor Cu balance that in some cases cannot be fix by designers difficult current soldering processes narrowing process window and reduce
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
. One notable discovery in this stage was that torsion testing of a notebook motherboard could result in PCB pad cratering due to strain from the high modulus SAC alloy
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