15 enig sac results

:  Impact functionality  Impact reliability 5 Typical Metal Combinations to be Soldered  Cu to Cu  Cu to Sn/Pb  Pd to Sn/Pb  Au to Sn/Pb  Ag to Ag  Sn to Ni  SS to SS  SAC to Sn/Pb  ImAg to SAC  ImSn to Sn/Pb  ENIG to SAC & SnPb  Etc. 6 Flux Selection Process

| https://www.eptac.com/wp-content/uploads/2007/10/webinar_eptac_10_17_07.pdf

:  Impact functionality  Impact reliability 5 Typical Metal Combinations to be Soldered  Cu to Cu  Cu to Sn/Pb  Pd to Sn/Pb  Au to Sn/Pb  Ag to Ag  Sn to Ni  SS to SS  SAC to Sn/Pb  ImAg to SAC  ImSn to Sn/Pb  ENIG to SAC & SnPb  Etc. 6 Flux Selection Process

| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_10_17_07.pdf

 Assemblies with all Lead-Free joints and joints with 63/37 BGA ball attached with SAC solder paste on ENIG and processed at 250oC showed very low early failure rate

| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_12_17_08.pdf

Solder Selection for Printed Circuit Boards and Terminals - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/solder-selection-for-printed-circuit-boards-and-terminals

? My second question is what kind of solder would you suggest for doing repair or adding a component to a surface mount board? Answer: The type of flux to be used is determined by the surfaces being soldered, such as HASL, OSP, ENIG, Gold, Pd, etc

. § Die size = 7, 10mm square § Liquidus peak = 250oC § Alloy type SAC 305 (217oC Melt Point) Test Results Void Ratio(Worst Case), [%] Sample Vacuum Level [torr] Dwell Time [sec] Worst Case [%] 1 5 30 0.21 2 5 120 0.39 3 10 30 0.36 4 10 60 0.26 5 20 30 0.20 6 20 60

46969 | https://hellerindustries.com/wp-content/uploads/2018/07/Inline-Vacuum-Reflow-System.pdf

Heller Industries Inc.

46969

. § Die size = 7, 10mm square § Liquidus peak = 250oC § Alloy type SAC 305 (217oC Melt Point) Test Results Void Ratio(Worst Case), [%] Sample Vacuum Level [torr] Dwell Time [sec] Worst Case [%] 1 5 30 0.21 2 5 120 0.39 3 10 30 0.36 4 10 60 0.26 5 20 30 0.20 6 20 60

46969 | https://hellerindustries.com/wp-content/uploads/2022/04/Inline-Vacuum-Reflow-System-1.pdf

Heller Industries Inc.

46969

Solder Selection for Printed Circuit Boards and Terminals - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/ask/solder-selection-for-printed-circuit-boards-and-terminals/

? My second question is what kind of solder would you suggest for doing repair or adding a component to a surface mount board? Answer: The type of flux to be used is determined by the surfaces being soldered, such as HASL, OSP, ENIG, Gold, Pd, etc

Properties of SAC-BI Solder Alloys With Aging *Sa'd Hamasha,Ph.D., Mohamed El Amine Belhadi, Raed Al Athamneh, Auburn University; Luke Wentlent, Ph.D., Universal Instruments Corporation Influence of a New Abnormal

40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628

Surface Mount Technology Association (SMTA)

40731

Properties of SAC-BI Solder Alloys With Aging *Sa'd Hamasha,Ph.D., Mohamed El Amine Belhadi, Raed Al Athamneh, Auburn University; Luke Wentlent, Ph.D., Universal Instruments Corporation Influence of a New Abnormal

40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200622100619

Surface Mount Technology Association (SMTA)

40731

Journal of SMT Articles

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm

. Abstract 28-4 Assessment of the Effect Of Mean Temperature on Thermal Cycling Reliability of SAC Solder Joints Using Leading Indicators of Failure Pradeep Lall, Ph.D., and Kazi Mirza Abstract 28-3 Non-destructive Evaluation of Solder Ball Quality under

Surface Mount Technology Association (SMTA)