| https://unisoft-cim.com/service_test.php
".ckt", Teradyne "ipl", Hewlett Packard "board & board x/y"), MDA, and flying probe test equipment (Takaya, Spea, etc.) and design the "Bed of Nails" test fixtures
Baja Bid | https://bajabid.com/auctions/page/5/?utm_source=SMTnet&utm_campaign=frymaster&utm_medium=banner&utm_content=468x60%2F
; 2007 Yestech YTV-F1 AOI Machines; GE PCBA ! Analyser 160 X-Ray; Hewlett Packard 3070 In-Circuit Testers; Vision Engineering Microscopes
| https://unisoft-cim.com/pcbtest.php
. ProntoTEST-FIXTURE programs popular newer and older Test equipment. Most Test machines are supported such as Keysight/Agilent/Hewlett Packard, Teradyne, GenRad, Takaya flying probe, Spea, Seica flying probe, Huntron, Jet Tester, Acculogic, Sprint Flying Probe, Javelin Flying Probe, etc
1st Place Machinery Inc. | http://www.firstplacemachinery.com/first_place_smt_pcb_test_xray_hp3070a.html
HP3070-2 Agilent HP3070 Series II Hewlett Packard - E4025 Test Head Serial Number: US34230065 Top Tray (6) E1046-66522 (1) 03066-66511 Botttom Tray (6) E1046-66522 (1) 03066-66511-MR (1
| https://unisoft-cim.com/download/OneFACTORY.pdf
) systems such as Hewlett Packard, Teradyne, Genrad, Takaya, etc. Gener- ate test fixture drill & wire plans & optimized test probe placements
| http://etasmt.com/cc?ID=te_news_bulletin,23567&url=_print
. A legendary study done a number of years ago by Hewlett-Packard revealed as much as 60% of solder defects in PCB assemblies were caused by such means
Baja Bid | https://bajabid.com/online-smt-auction-featuring-items-nypro/
; 2007 Yestech YTV-F1 AOI Machines; Hewlett Packard 3070 In-Circuit Testers; Takaya APT9401CJ Flying Probe Tester; Vision Engineering Microscopes
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/page/670?order=name+asc
0.0 CNY Hengstler encoder ¥ 0.00 0.0 CNY Heraeus Fusion F300 UV Lamp #558434D Bulb ¥ 0.00 0.0 CNY Hewlett-Packard Agilent Synthesized Signal Gen 0.1-6000MHz. ¥ 0.00 0.0 CNY Hex Jam Nut ¥ 0.00 0.0 CNY Hex Jam Nut ( 5/16-18 ) ¥ 0.00
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23567.chtml
. A legendary study done a number of years ago by Hewlett-Packard revealed as much as 60% of solder defects in PCB assemblies were caused by such means
| http://etasmt.com/te_news_bulletin/2021-08-31/23567.chtml
. A legendary study done a number of years ago by Hewlett-Packard revealed as much as 60% of solder defects in PCB assemblies were caused by such means
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