| http://etasmt.com/cc?ID=te_news_bulletin,23572&url=_print
. Process and design-related causes: • Excessive volume of solder due to improper pad dimension • Excessive volume of solder due to improper stencil aperture
| http://etasmt.com/cc?ID=te_news_bulletin,23573&url=_print
. Process and design-related causes: • Solder paste flux not aggressive enough for level of oxidation present on part or PCB • PCB pad contaminated
| http://etasmt.com/cc?ID=te_news_bulletin,23568&url=_print
: solder balls Solder balls are very small fines of solder that have separated from the main body that forms the joint. Their formation is promoted by excessive oxides in the solder paste that inhibit solder coalescence during reflow
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23572.chtml
. Process and design-related causes: • Excessive volume of solder due to improper pad dimension • Excessive volume of solder due to improper stencil aperture
| http://etasmt.com/te_news_bulletin/2021-08-31/23572.chtml
. Process and design-related causes: • Excessive volume of solder due to improper pad dimension • Excessive volume of solder due to improper stencil aperture
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23568.chtml
. Their formation is promoted by excessive oxides in the solder paste that inhibit solder coalescence during reflow. Solder ball defects are probably the most common reflow solder defect, and there are many causes of solder ball defects beyond the system that will contribute to their formation
| http://etasmt.com/te_news_bulletin/2021-08-31/23568.chtml
. Their formation is promoted by excessive oxides in the solder paste that inhibit solder coalescence during reflow. Solder ball defects are probably the most common reflow solder defect, and there are many causes of solder ball defects beyond the system that will contribute to their formation
| http://etasmt.com/cc?ID=te_news_bulletin,23574&url=_print
>> News Circuit Board Voids & PCB Delamination Circuit Board Voids Circuit Board Voids are cavities or air pockets inside the solder joint formed by gases that are released during reflow or by flux residues that fail to escape
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/fr-FR/divisions/industrial-coating-systems/application-solutions/powder-coating/hdlv-technology/principle
de l'application de la poudre. Par ailleurs, la trop grande vitesse du flux de poudre est la principale cause de l’usure excessive des composants internes du système de
Heller 公司 | http://hellerindustries.com.cn/00600-248.pdf
. The typical form for such a profile, Figure 1b, is commonly referred to as a “tent” or “straight ramp” profile. For no- clean pastes, which have less active fluxes, excessive dwell time serves only to deplete the flux before reflow
winsouce.jpg)
