| http://etasmt.com/cc?ID=te_news_industry,24564&url=_print
. The oxide layer on pads or the pin’s surface has not been removed effectively. The solder paste has expired, so its flux is inactive
| http://etasmt.com/cc?ID=te_news_bulletin,23574&url=_print
• Improper solder volume due to improper stencil design • Paste viscosity too low • Paste metal content too low • Bad or expired solder paste
| http://etasmt.com/cc?ID=te_news_bulletin,23568&url=_print
. Process and design-related causes: • Improper pad design • Weak solder paste (for ambient con-ditions) • Expired solder paste • Misaligned print (overlapping solder mask
| http://etasmt.com/te_news_industry/2021-09-01/24564.chtml
. The oxide layer on pads or the pin’s surface has not been removed effectively. The solder paste has expired, so its flux is inactive
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23568.chtml
. Process and design-related causes: • Improper pad design • Weak solder paste (for ambient con-ditions) • Expired solder paste • Misaligned print (overlapping solder mask
| http://etasmt.com/te_news_bulletin/2021-08-31/23568.chtml
. Process and design-related causes: • Improper pad design • Weak solder paste (for ambient con-ditions) • Expired solder paste • Misaligned print (overlapping solder mask
| http://etasmt.com/te_news_bulletin/2021-08-31/23574.chtml
• Improper solder volume due to improper stencil design • Paste viscosity too low • Paste metal content too low • Bad or expired solder paste
Blackfox Training Institute, LLC | https://www.blackfox.com/4-common-errors-in-smt-assembly/
. An expired solder paste is also a common cause of this defect. To prevent Non-Wetting and De-Wetting, make sure to clean the boards first
| http://etasmt.com/cc?ID=te_news_bulletin,23576&url=_print
. Process and design-related causes: • Impurity in the component plating • Impurity in the circuit board finish • Bad or expired solder paste
Heller Industries Inc. | https://hellerindustries.com/voids/
content too low Bad or expired solder paste Ambient humidity too high for solder paste work envelope Reflow-related causes of circuit board voids
