PCB Libraries, Inc. | https://www.pcblibraries.com/forum/via-naming-convention_topic2038_post8354.html
Via Naming Convention - PCB Libraries Forum Forum Home > Libraries > Footprints / Land Patterns > OrCAD Layout New Posts FAQ Search Events Register Login Via Naming Convention
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/via-naming-convention_topic2038.html
Via Naming Convention - PCB Libraries Forum Forum Home > Libraries > Footprints / Land Patterns > OrCAD Layout New Posts FAQ Search Events Register Login Via Naming Convention
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2038&OB=ASC.html
Via Naming Convention - PCB Libraries Forum Forum Home > Libraries > Footprints / Land Patterns > OrCAD Layout New Posts FAQ Search Events Register Login Via Naming Convention
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_via-fanout-for-bga_topic1888.xml
. Many CAD tools have automatic via fanout and if it doesn't, you need to ask the CAD vendor to add that feature into the CAD tool. Vias in a PCB Footprint library part become Pins and the BGA pad and via connecting line become Associated Copper
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/via-fanout-for-bga_topic1888_post7702.html
. Vias in a PCB Footprint library part become Pins and the BGA pad and via connecting line become Associated Copper. This makes the library part size very big
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/via-fanout-for-bga_topic1888.html
. Many CAD tools have automatic via fanout and if it doesn't, you need to ask the CAD vendor to add that feature into the CAD tool. Vias in a PCB Footprint library part become Pins and the BGA pad and via connecting line become Associated Copper
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1888&OB=ASC.html
. Many CAD tools have automatic via fanout and if it doesn't, you need to ask the CAD vendor to add that feature into the CAD tool. Vias in a PCB Footprint library part become Pins and the BGA pad and via connecting line become Associated Copper
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_pcb-via-terms-and-applications_topic1596.xml
: a technology that allows to design VIP (via in pad) because of flatness surface. Copper via filling as resin via filling plus copper capping are the two main technological solution available today. Solder Mask Covered: a pad or via (via tenting
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/pcb-via-terms-and-applications_topic1596_post6956.html
: a technology that allows to design VIP (via in pad) because of flatness surface. Copper via filling as resin via filling plus copper capping are the two main technological solution available today
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/qfn-thermal-via-pitch_topic2914.html
QFN Thermal Via Pitch - PCB Libraries Forum Forum Home > Libraries > Footprints / Land Patterns > Altium New Posts FAQ Search Events Register Login QFN Thermal Via Pitch
