Imagineering, Inc. | https://www.pcbnet.com/blog/the-role-of-pcb-assembly-and-fabrication-in-the-aerospace-industry/
. However, pure copper is also chemically active, requiring a coating over exposed copper to prevent corrosion. These coatings typically include aerosol coatings and solder masks, although manufacturers may also use epoxy coatings as a barrier to oxidation
Imagineering, Inc. | https://www.pcbnet.com/blog/understanding-the-pcb-fabrication-process-from-design-to-delivery/
. For example, electroless nickel immersion gold (ENIG) is a common surface finish due to its long shelf life and RoHS compliance . However, it’s more expensive than other options
| https://www.eptac.com/blog/leaded-vs-lead-free-solder-which-is-better
. Lead-free solders typically contain a variety of different metals. Some of the components you may find in lead-free solder include tin, copper, silver, nickel and zinc
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
. However, until such time that ImAg is proven to not creep corrode, Dell will not employ this surface finish for critical business products that may be exposed to such harsh environments
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
., Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephani Gulbrandsen, Julie Silk, Alex Chiu, and Yew-Hoong Chan Abstract 26-4 Is a High Phosphorus Content in the Nickel Layer A Root Cause for Black Pad on ENIG Finishes? Dipl.-Ing. Mustafa Özkök, Joe
| https://www.eptac.com/wp-content/uploads/2015/03/ecss_q_st_70_18c-space-product-assurance-rf-coax-cables.pdf
maintain the following environmental conditions in the area: 1. Room temperature: (22 ± 3) °C 2. Relative humidity at room temperature (55 ± 10) %. c. The work stations shall not be exposed to draughts. 13 ECSS‐Q‐ST‐70‐18C 15 November 2008 d
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