Partner Websites: f-optp-50 (Page 1 of 80)

Poron Cellular Urethane Foams Industrial Materials

ORION Industries | http://orionindustries.com/pdfs/PORONURETHANE.pdf

”) ASTM D150 measurements @ 72°F (22°C) relative humidity 50% for 24 hrs. 1.75 1.71 1.63 1.60 Dissipation Factor, tan D (“DF”) ASTM D150 0.05 0.05 0.05 0.05 Dielectric Strength, volts/mil ASTM D149 50 50 50 50 ENVIRONMENTAL Corrosion Resistance AMS 3568 Pass Pass

ORION Industries

00329316-02_Suzhou Feierte electronic co.,ltd

KD Electronics Ltd. | http://www.kundasmt.com/a/PRODUCTS/1053.html

. S 50 SCALE X-ACHSE F. S 50 PREVIOUS: 00329280S01 NEXT: 00329380-03 RELATED PRODUCTS CATEGORIES ABOUT US + SURFACE MOUNT SYSTEM + REFLOW FURNACE + OTHER PARTS + CONTACT US + CONTACT US Tel

KD Electronics Ltd.

00329316-02_Suzhou Feierte electronic co.,ltd

KD Electronics Ltd. | http://www.kundasmt.com/a/PRODUCTS/PRODUCTSA/PARTS/1053.html

:00329316-02 Description: SCALE X-ACHSE F. S 50 SCALE X-ACHSE F. S 50 Previous: 00329280S01 Next: 00329380-03 RELATED PRODUCTS CATEGORIES ASM EQUIPMENT Equipment Accessories PANASONIC EQUIPMENT Equipment Accessories YAMAHA EQUIPMENT Equipment Accessories FUJI EQUIPMENT Equipment Accessories JUKI

KD Electronics Ltd.

00329316-02-Equipment Accessories-Suzhou Feierte electronic co.,ltd-welcome to KD Electronic

KD Electronics Ltd. | http://www.kundasmt.com/?A-Equipment-Accessories/1394.html

KOHYOUNG NUTEK OTHER PARTS CONTACT US welcome to KD Electronic Equipment Accessories Product number:00329316-02 Description: SCALE X-ACHSE F. S 50 SCALE X-ACHSE F

KD Electronics Ltd.

75% Barrel Fill Requirement for Class 2 Change in J-STD-001 Revision F - EPTAC - Train. Work Smarter

| https://www.eptac.com/faqs/ask-helena-leo/ask/75-barrel-fill-requirement-for-class-2-change-in-j-std-001-revision-f

: Why did the IPC change the barrel fill requirement for Class 2 in J-STD-001 Revision F? Revision E allowed 50% when there was a thermal plane. Now, Rev. F states 75

75% Barrel Fill Requirement for Class 2 Change in J-STD-001 Revision F - EPTAC - Train. Work Smarter

| https://www.eptac.com/ask/75-barrel-fill-requirement-for-class-2-change-in-j-std-001-revision-f/

: Why did the IPC change the barrel fill requirement for Class 2 in J-STD-001 Revision F? Revision E allowed 50% when there was a thermal plane. Now, Rev. F states 75

VersaBlue® Schmelzgeräte

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-de/products/adhesive-dispensing-systems-products/versablue-melters

) Betriebstemperaturbereich 4 40 bis 230 °C (100 bis 450 °F) Umgebungstemperaturbereich 0 bis 40 °C (32 bis 104 °F) Temperaturregelung Stabilität  +/- 1 Grad (2 °F) Elektrischer Service 5 240 VAC 1 Phase Dreieck 50/60 Hz 6 200 VAC 3 Phasen Dreieck 50/60 Hz 7 200 bis 240 VAC 3 Phasen Y 50/60 Hz 380 bis 415 VAC-Y

ASYMTEK Products | Nordson Electronics Solutions

IPC-A-610 Revision F Paragraph 7.3.5.1 Supported Holes - Solder - Vertical Fill (A) - EPTAC - Train.

| https://www.eptac.com/faqs/ask-helena-leo/ask/ipc-a-610-revision-f-paragraph-7-3-5-1-supported-holes-solder-vertical-fill-a

: Minimum vertical fill of 50% or 1.2 mm for components with 14 or more leads. What is the...   Question: We have a couple of questions regarding the new IPC-A-610 Revision F document and vertical fill. They are: . Acceptable – Class 1,23

ABM3-50.000MHZ-D2Y-F-T - Abracon - Free Library Parts

PCB Libraries, Inc. | https://www.pcblibraries.com/POD/Default.asp?M=ABRACON&PN=ABM3-50.000MHZ-D2Y-F-T

ABM3-50.000MHZ-D2Y-F-T - Abracon - Free Library Parts   LOGIN   Downloads About Footprint Expert Parts Forum Distributors Sales

PCB Libraries, Inc.

Adhesive Transfer Tapes with Adhesive 300LSE, 9453LE, 9471LE, 9471LE

ORION Industries | http://orionindustries.com/pdfs/300lse.pdf

. Chilling the adhesive between 35°F and 50°F will improve the processability. In addition, dies can be lubricated with Laminoleum evaporative stamping oil, which is available from Metal Lubricants Company (708-333-8900

ORION Industries

  1 2 3 4 5 6 7 8 9 10 Next

f-optp-50 searches for Companies, Equipment, Machines, Suppliers & Information

Voidless Reflow Soldering

Component Placement 101 Training Course
Circuit Board, PCB Assembly & electronics manufacturing service provider

High Precision Fluid Dispensers
pressure curing ovens

Best Reflow Oven
SMT feeders

World's Best Reflow Oven Customizable for Unique Applications


Internet marketing services for manufacturing companies