| https://www.eptac.com/webinars/the-fundamentals-of-solder-joint-design-part-1-through-hole-technology-tht
? Sure we can pull test and stress the solder joint, but these things don’t fail that way. They fail by many years of fatigue, or more importantly, by stress fractures occurring over years of cycling in the environment
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/x-ray-inspection-systems/x-ray-inspection-guide
X-ray Inspection Guide X-Ray Inspection and Test Products Corporate | Global Directory | Languages Division Only All of Nordson Home Products Bondtesting Systems Micro Materials Testing Wafer Inspection and Metrology X-ray Inspection Systems X-ray Counting Systems Applications Battery
| https://www.eptac.com/wp-content/uploads/2015/02/eptac_03_18_15-1.pdf
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic801&OB=DESC.html
) to fail on parts with Rectangular Pad Shape Nick B Members Profile Send Private Message Find Members Posts Add to Buddy List Admin Group Joined: 02 Jan 2012 Status: Offline Points
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic801&OB=ASC.html
– Added the ability to provide a custom name for the Hole Layer via the UI Expedition – Fixed some problems that were causing admin to fail Expedition
| https://www.eptac.com/webinar/the-fundamentals-of-solder-joint-design-part-1-through-hole-technology-tht/
? Sure we can pull test and stress the solder joint, but these things don’t fail that way. They fail by many years of fatigue, or more importantly, by stress fractures occurring over years of cycling in the environment
| http://etasmt.com/te_news_bulletin/2021-08-31/23574.chtml
& PCB Delamination From: Author: Publish time:2021-08-31 17:39 Clicks:16 Circuit Board Voids Circuit Board Voids are cavities or air pockets inside the solder joint formed by gases that are released during reflow or by flux residues that fail to escape from the solder before it solidifies
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/mr-louis-lin-from-nordson-dage-to-present-at-ipc-southeast-asia-high-reliability-conference
Mr Louis Lin from Nordson DAGE to Present at IPC Southeast Asia High Reliability Conference X-Ray Inspection and Test Products Corporate | Global Directory
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/efd/about-us/standards/ipc-j
– Solderability Test for Printed Boards (Lötbarkeitsprüfung für Leiterplatten) J-STD-004 – General Requirements and Test Methods for Soldering Fluxes
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