ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/nordson-dages-peter-koch-to-discuss-failure-analysis-with-xray-at-epps-innovations-forum
. Koch will discuss failures on BGAs, HiP (Head-in-Pillow) defects, cracks and simple failures such as solder bridges. Most of these failures can be detected with 2D inspection
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/peter-koch-of-nordson-dage-will-discuss-failure-analysis-with-x-ray-at-eteks-technology-event
“Failure Analysis with X-Ray – in 2D, Tomosynthesis and CT.” Mr. Koch will discuss failures on BGAs, HiP (Head in Pillow) defects, cracks and simple failures such as solder bridges
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/process/surface-modification?con=t&page=4
bonding surface, reducing device failures Nordson MARCH's Compact ModVIA Plasma System is Easily Expandable from 4 to 8 Cells to Increase Machine Capacity for Production Demands Nordson MARCH Performs
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/industries/medical-life-science-and-pharmaceutical?con=t&page=10
Reduce Wire Bond Failures, Now Available Online Nordson MARCH Describes wire bond failures, their causes, and ways to eliminate them Plasma Clean to Reduce Wire Bond Failures Nordson MARCH SEMICON
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/industries/automotive-and-transportation?con=t&page=8
−Gold-Plated Copper Leadframe Interface Nordson MARCH Nordson MARCH White Paper, Plasma Clean to Reduce Wire Bond Failures, Now Available Online Nordson MARCH Describes wire bond failures, their causes
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/process/anisotropic-and-isotropic-etch?con=t&page=10
#5743 Bonding Strengths at Plastic Encapsulent−Gold-Plated Copper Leadframe Interface Nordson MARCH Nordson MARCH White Paper, Plasma Clean to Reduce Wire Bond Failures, Now Available Online Nordson MARCH Describes wire bond failures, their causes
| https://www.eptac.com/faqs/ask-helena-leo/ask/solder-flow-near-through-hole-component-body
– Touching Through Hole Component Body. The intent is that the solder can climb up the lead, but not touch the body. When solder touches the body it can destroy the seal where the lead enters the body of the component and this could cause failures in the component by allowing moisture to enter the component and
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/applications/plasma-treating?con=t&page=12
. Plasma Clean to Reduce Wire Bond Failures Nordson MARCH FlexTRAK-CD Plasma System - Ltr Nordson MARCH Nordson MARCH White Paper, Plasma Clean to Reduce Wire Bond Failures, Now Available Online
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types-2020/cold-bump-pull
. Also border line failures can under some circumstances gain support from the side wall of a cavity and traditional shear testing may miss this
| https://www.eptac.com/ask/solder-flow-near-through-hole-component-body/
– Touching Through Hole Component Body. The intent is that the solder can climb up the lead, but not touch the body. When solder touches the body it can destroy the seal where the lead enters the body of the component and this could cause failures in the component by allowing moisture to enter the component and
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