| https://www.eptac.com/faqs/ask-helena-leo/ask/solder-touching-glass-body-components-like-diodes
: IPC-610 has many areas that are left to ones interpretation. The area for solder touching glass body components is one of them. The IPC mentions this along with the subject of maximum fillet height and the image that sets in some... Question
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/RSS_ipcjstd001-gull-wing-leads-and-solder-joints_topic2587.xml
0.65 mm and the Toe should be 0.50 mm for the best Toe Fillet. The DPAK is a separate component family Terminal Lead Form in Library Expert with different Toe values than SOP, QFP, SOT and SOD.
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipcjstd001-chip-component-solder-joints_topic2588_post11181.html
as defined in the IPC-7351 guideline. The Toe solder joint goal is the most important for the Chip Terminal Lead and the J-STD-001 Minimum Fillet Height for a Chip Component for the Toe Goal is
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipcjstd001-chip-component-solder-joints_topic2588_post11181.html
as defined in the IPC-7351 guideline. The Toe solder joint goal is the most important for the Chip Terminal Lead and the J-STD-001 Minimum Fillet Height for a Chip Component for the Toe Goal is
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipcjstd001-chip-component-solder-joints_topic2588_post12081.html
as defined in the IPC-7351 guideline. The Toe solder joint goal is the most important for the Chip Terminal Lead and the J-STD-001 Minimum Fillet Height for a Chip Component for the Toe Goal is
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipcjstd001-chip-component-solder-joints_topic2588_post12079.html
as defined in the IPC-7351 guideline. The Toe solder joint goal is the most important for the Chip Terminal Lead and the J-STD-001 Minimum Fillet Height for a Chip Component for the Toe Goal is
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipcjstd001-chip-component-solder-joints_topic2588_post11251.html
as defined in the IPC-7351 guideline. The Toe solder joint goal is the most important for the Chip Terminal Lead and the J-STD-001 Minimum Fillet Height for a Chip Component for the Toe Goal is
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipcjstd001-chip-component-solder-joints_topic2588_post10536.html
as defined in the IPC-7351 guideline. The Toe solder joint goal is the most important for the Chip Terminal Lead and the J-STD-001 Minimum Fillet Height for a Chip Component for the Toe Goal is
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2588&OB=ASC.html
as defined in the IPC-7351 guideline. The Toe solder joint goal is the most important for the Chip Terminal Lead and the J-STD-001 Minimum Fillet Height for a Chip Component for the Toe Goal is
| https://www.eptac.com/ask/solder-touching-glass-body-components-like-diodes/
: IPC-610 has many areas that are left to ones interpretation. The area for solder touching glass body components is one of them. The IPC mentions this along with the subject of maximum fillet height and the image that sets in some peoples minds is that
