PCB Libraries, Inc. | https://www.pcblibraries.com/forum/does-capacitor-height-affect-pad-geometry_topic2366_post9714.html
? Posted: 03 Feb 2019 at 8:55am According to IPC-J-STD-001, the chip package fillet height should be 25% of the package height or 0.50 mm, which ever is greater
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/does-capacitor-height-affect-pad-geometry_topic2366_post10025.html
? Posted: 03 Feb 2019 at 8:55am According to IPC-J-STD-001, the chip package fillet height should be 25% of the package height or 0.50 mm, which ever is greater
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/does-capacitor-height-affect-pad-geometry_topic2366.html
. Minimum Solder Joint Fillet Height = 25% of package Height or 0.50 mm, whichever is less. So the maximum required fillet = 0.50 mm regardless of the package height
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/does-capacitor-height-affect-pad-geometry_topic2366.html
. Minimum Solder Joint Fillet Height = 25% of package Height or 0.50 mm, whichever is less. So the maximum required fillet = 0.50 mm regardless of the package height
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2366&OB=ASC.html
. Minimum Solder Joint Fillet Height = 25% of package Height or 0.50 mm, whichever is less. So the maximum required fillet = 0.50 mm regardless of the package height
| https://www.eptac.com/faqs/ask-helena-leo/ask/solder-touching-glass-body-components-like-diodes
: IPC-610 has many areas that are left to ones interpretation. The area for solder touching glass body components is one of them. The IPC mentions this along with the subject of maximum fillet height and the image that sets in some... Question
| https://www.eptac.com/ask/solder-touching-glass-body-components-like-diodes/
: IPC-610 has many areas that are left to ones interpretation. The area for solder touching glass body components is one of them. The IPC mentions this along with the subject of maximum fillet height and the image that sets in some peoples minds is that
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipcjstd001-chip-component-solder-joints_topic2588_post11181.html
as defined in the IPC-7351 guideline. The Toe solder joint goal is the most important for the Chip Terminal Lead and the J-STD-001 Minimum Fillet Height for a Chip Component for the Toe Goal is
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipcjstd001-chip-component-solder-joints_topic2588_post11181.html
as defined in the IPC-7351 guideline. The Toe solder joint goal is the most important for the Chip Terminal Lead and the J-STD-001 Minimum Fillet Height for a Chip Component for the Toe Goal is
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/ipcjstd001-chip-component-solder-joints_topic2588_post12081.html
as defined in the IPC-7351 guideline. The Toe solder joint goal is the most important for the Chip Terminal Lead and the J-STD-001 Minimum Fillet Height for a Chip Component for the Toe Goal is
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