| https://www.eptac.com/soldertips/soldertip-48-the-cleanliness-of-wire-and-terminal-connections/
. Now for the requirements of whether or not the flux residues should be removed or cleaned is based upon the visual appearance of the flux
| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-48-the-cleanliness-of-wire-and-terminal-connections
. Now for the requirements of whether or not the flux residues should be removed or cleaned is based upon the visual appearance of the flux
| https://www.eptac.com/soldertip/soldertip-48-the-cleanliness-of-wire-and-terminal-connections/
. Now for the requirements of whether or not the flux residues should be removed or cleaned is based upon the visual appearance of the flux
| http://etasmt.com/cc?ID=te_news_bulletin,16761&url=_print
. So then solder the other PCB side, The rail of reflow oven is easy to deform. The rail of reflow oven will not contract through thermal expansion and cold, and when the temperature drops, it is impossible for the track to change back to its original appearance
| http://etasmt.com:9060/te_news_industry/2013-07-03/5361.chtml
. 10, Joint Appearance: solder joint appearance should be close to the appearance of the tin / lead solder. 11, Supply capacity. 12, Compatibility with lead
| http://etasmt.com/te_news_industry/2013-07-03/5361.chtml
. 10, Joint Appearance: solder joint appearance should be close to the appearance of the tin / lead solder. 11, Supply capacity. 12, Compatibility with lead
| http://etasmt.com/te_news_bulletin/2020-06-04/16761.chtml
. So then solder the other PCB side, The rail of reflow oven is easy to deform. The rail of reflow oven will not contract through thermal expansion and cold, and when the temperature drops, it is impossible for the track to change back to its original appearance
