ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2299-delaminations
. The gating used here has also captured the attachment of some components to the far side of the board. The red areas are a concern because they will reduce the heat sink function
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0148-pqfp-die-attach
& Method A PQFP was imaged from the top side at a frequency of 15 MHz. Gating was on the die attach. Result The yellow central area is die attach material
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2250-lead-and-paddle-delaminations
Lead and Paddle Delaminations - Application Note 2250 Sample & Method An SOJ imaged on C-SAM, with gating at the die, lead frame and paddle depths
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2614-c-sam-and-q-bam
). Result Gating in the planar image was at the interface between the molding compound and the substrate. The vertical white structures in the planar image are delaminations between the molding compound and the substrate
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1016-voids-and-bond-defects
through the substrate side. Gating was on the interface between the cured underfill and the substrate, and includes the bonding of the solder balls to their pads
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1020-voids
. This COB was imaged by C-SAM® at an ultrasonic frequency of 15 MHz. Gating of the return echoes was on the die surface level. Result In this image, the red area is a void in contact with the interconnect wires along the edge of the die
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0759-tsop-cracked-die
). Each tray held 60 devices. Gating was on the die. Result There are no molding compound to die surface delaminations in the samples
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1011-pbga-delaminations
. Gating was on the interface between the molding compound and the substrate. Result The two packages at top have no significant internal defects
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1053-pdip-delaminations-on-the-backside
) was imaged at 15 MHz from the back side of the package. Gating was on the interface between the molding compound and the lead frame and paddle
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1054-lead-delaminations
) was imaged at 15 MHz from the top side of the package. Gating was on the interface between the molding compound and the lead frame and paddle
