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. Recent Posts Solder Pot Maintenance and Dross Removal What’s with the expiration dates on solder paste or wire? Accept or Reject: Solder Contacting Component Bodies Issues of Burnt Flux on Class 3 PCB Assemblies Gold Removal Issues with Hollow Cup Connectors Acceptability of Conformal Coating Bubbles Search Looking for Training Products? SolderTraining.com can help
? Read Answer Failing to Remove Gold Plating in Final Assembly Question: If the gold plating on the surface of via holes is not removed from the printed circuit boards, does this constitute a defect or failure of the
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) when the solder gold content exceeds 5% by weight. Controlling the component gold plating thickness as well as the soldering process temperature and time can prevent gold embrittlement
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: When Gold Removal is a Must Length: 31 Minutes We hear/are asked this question all the time. When do I need to remove gold plating and why do I have too
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. Solder joint strength is based upon many things, such as size of pad/land, amount of solder, excursion through the thermal zone, plating integrity of the component and the board, etc
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* Materials FR4(130Tg) FR4(170Tg) Copper Weight 1 oz 2 oz 3 oz 4 oz Finish Plating HASL (Leaded) LF HASL Immersion Gold Immersion Silver White Tin OSP Minimum Trace/Space 0.005" 0.006" 0.007
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: Gold Removal and Wave Soldering vs Hand Soldering General Tip Question: Regarding gold removal requirement under Section 4.5.1 of J-STD-001, it allows
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: Gold Removal and Wave Soldering vs Hand Soldering General Tip Question: Regarding gold removal requirement under Section 4.5.1 of J-STD-001, it allows
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