Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
. Recommendations are made for further work based on other void reduction methods and additional reliability studies. Key words: Solder joint voiding, vacuum reflow processing, thermal fatigue reliability, thermal cycling, lead-free alloys
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/brittle-fracture-testing?con=t&page=14
. Creep test Nordson DAGE Time dependent deformation is an important failure mechanism. Our experience with solder has led us to develop methods for applying loads to small samples as the solder joint is the weakest… First
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/brittle-fracture-testing?con=t&page=15
-Destructive Techniques for Identifying Defect in BGA Joints: TDR, 2DX and Cross-section/SEM Comparison Nordson DAGE Explorer one Brochure v5c web Nordson DAGE Selection Criteria for X-ray Inspection Systems for BGA and CSP Solder Joint Analysis Nordson DAGE
| http://etasmt.com/cc?ID=te_news_industry,3761&url=_print
. The importance of solder joint reliability became more emphasized in recent years as a result of two factors: 1) the shift of the semiconductor industry to lead-free solders; and 2
| http://etasmt.com:9060/te_news_industry/2013-04-05/3761.chtml
. The importance of solder joint reliability became more emphasized in recent years as a result of two factors: 1) the shift of the semiconductor industry to lead-free solders; and 2
| http://etasmt.com/te_news_industry/2013-04-05/3761.chtml
. The importance of solder joint reliability became more emphasized in recent years as a result of two factors: 1) the shift of the semiconductor industry to lead-free solders; and 2
| https://www.eptac.com/soldertips/soldertip-47-how-long-does-it-take-to-make-a-solder-joint/
. To make this metallurgical connection one must get the total area to be joined together with solder to at least 500F. Considering the time it takes the solder iron to heat the lead, the board and the solder it can take up to 1 to 3 seconds to do this, depending upon the total metallic mass of the solder joint to be created
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
. Recommendations are made for further work based on other void reduction methods and additional reliability studies. Key words: Solder joint voiding, vacuum reflow processing, thermal fatigue reliability, thermal cycling, lead-free alloys
| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-47-how-long-does-it-take-to-make-a-solder-joint
. To make this metallurgical connection one must get the total area to be joined together with solder to at least 500F. Considering the time it takes the solder iron to heat the lead, the board and the solder it can take up to 1 to 3 seconds to do this, depending upon the total metallic mass of the solder joint to be created
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide
: Select Your Alloy When choosing a solder alloy, there are a few questions that need to be answered. Does the alloy need to be lead free
