Partner Websites: gold over nickel plated (Page 1 of 7)

SolderTips: Solderability Issues with Nickle Plated Surfaces - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces

: Solderability Issues with Nickle Plated Surfaces Question: We are working with components with leads of tin/lead over nickel. After the manufacturing processes, some of the pins are exhibiting what appears to be flaking plating, leaving behind unsolderable surfaces

SolderTips: Solderability Issues with Nickle Plated Surfaces - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces/

: We are working with components with leads of tin/lead over nickel. After the manufacturing processes, some of the pins are exhibiting what appears to be flaking plating, leaving behind unsolderable surfaces

J-STD-001 Revision Changes Regarding The Requirements for Gold Plating Removal

| https://www.eptac.com/blog/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal

] or more of gold thickness. b. From 95% of all surfaces to be soldered of surface mount components regardless of gold thickness. c. From the surfaces to be soldered of solder terminals plated with

Gold Wire Bond Failing Pull Test - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-wire-bond-failing-pull-test

? Does it have a Nickel underplate? How thick is the gold plating? I’ve checked Mil-Std-883F method 2011.7 Bond Strength (Destructive Bond Pull Test

Gold Wire Bond Failing Pull Test - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/ask/gold-wire-bond-failing-pull-test/

? Does it have a Nickel underplate? How thick is the gold plating? I’ve checked Mil-Std-883F method 2011.7 Bond Strength (Destructive Bond Pull Test

J-STD-001F 4.5.1 Gold Removal Class 2 Requirement Changed - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001f-4-5-1-gold-removal-class-2-requirement-changed

)? Connectors and surface mount oscillators are only available in Gold over Nickel...   Question: Why did the IPC make the gold removal requirement for Class 2 products a requirement (D2D3

J-STD-001F 4.5.1 Gold Removal Class 2 Requirement Changed - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/ask/j-std-001f-4-5-1-gold-removal-class-2-requirement-changed/

)? Connectors and surface mount oscillators are only available in Gold over Nickel terminations and are difficult to tin and re-package. Answer: The reasoning for the change was due to the failures happening in the field with these types of components

J-STD-001 Revision Changes Regarding The Requirements for Gold Plating Removal - EPTAC - Train. Work

| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/

] or more of gold thickness. b. From 95% of all surfaces to be soldered of surface mount components regardless of gold thickness. c. From the surfaces to be soldered of solder terminals plated with

SolderTips: Gold Removal and Wave Soldering vs Hand Soldering - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/

”. Does this mean that if we run a through-hole CCA thru a wave solder machine twice it would meet the gold removal requirements? If not, how would we tin the gold plated components by wave soldering? Answer

SolderTips: Gold Removal and Wave Soldering vs Hand Soldering - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering

”. Does this mean that if we run a through-hole CCA thru a wave solder machine twice it would meet the gold removal requirements? If not, how would we tin the gold plated components by wave soldering? Answer

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