| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces
: Solderability Issues with Nickle Plated Surfaces Question: We are working with components with leads of tin/lead over nickel. After the manufacturing processes, some of the pins are exhibiting what appears to be flaking plating, leaving behind unsolderable surfaces
| https://www.eptac.com/soldertips/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/
? If not, how would we tin the gold plated components by wave soldering? Answer: Soldering gold parts onto printed circuit boards follows Paragraph
| https://www.eptac.com/blog/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal
] or more of gold thickness. b. From 95% of all surfaces to be soldered of surface mount components regardless of gold thickness. c. From the surfaces to be soldered of solder terminals plated with
| https://www.eptac.com/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/
”. Does this mean that if we run a through-hole CCA thru a wave solder machine twice it would meet the gold removal requirements? If not, how would we tin the gold plated components by wave soldering? Answer
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering
”. Does this mean that if we run a through-hole CCA thru a wave solder machine twice it would meet the gold removal requirements? If not, how would we tin the gold plated components by wave soldering? Answer
| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/
] or more of gold thickness. b. From 95% of all surfaces to be soldered of surface mount components regardless of gold thickness. c. From the surfaces to be soldered of solder terminals plated with
| https://www.eptac.com/wp-content/uploads/2012/09/eptac_10_17_12.pdf
| https://www.eptac.com/faqs/ask-helena-leo/ask/maximum-limits-of-solder-bath-contamination
. For examples component coming in with Lead-free coating and need to be tin/lead coated, this is a preconditioning element, and the same applied if the tin plated components have to be changed to SAC
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-usa/?cpn=3
0.025", smallest hole 0.015", all Plated holes, smallest trace/space 0.007", Green LPI Mask, White Top Silkscreen, Individual board with Single circuit design and No Multiple images of boards. File type: 274x required. No paint
