47 gold thickness on 2n2 results

J-STD-001 Revision Changes Regarding The Requirements for Gold Plating Removal

| https://www.eptac.com/blog/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal

2.54 μm [100 μin] or more of gold thickness. A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly

J-STD-001 Revision Changes Regarding The Requirements for Gold Plating Removal - EPTAC - Train. Work

| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/

2.54 μm [100 μin] or more of gold thickness. A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly

SolderTips: Gold Removal and Wave Soldering vs Hand Soldering - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering

: “A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly”...   Question: Regarding gold removal requirement under Section

J-STD-001E-2010: 4.5.1, Gold Removal Issues - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001e-2010-4-5-1-gold-removal-issues

: 4.5.1, Gold Removal Issues Question: Since we are seeing more and more components with gold finish on the solder attachment pads(specifically, leadless ICs mostly with bottom side terminations only for RF circuitry

SolderTips: Gold Removal and Wave Soldering vs Hand Soldering - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/

: Regarding gold removal requirement under Section 4.5.1 of J-STD-001, it allows: “A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly

] or more of gold thickness. •  A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly

| https://www.eptac.com/wp-content/uploads/2016/05/eptac_06_22_16.pdf

. –  From the surfaces to be soldered of solder terminals plated with 2.54 µm [100 µin] or more of gold thickness. –  A double tinning process or dynamic solder wave may be used for gold removal prior to soldering the component on or in the assembly, either Surface Mount or Plated Through Hole components 2 The Criteria J-STD-001 ES 4.5.1 Gold Removal

| https://www.eptac.com/wp-content/uploads/2012/09/eptac_10_17_12.pdf

. •  On the data sheet of the connector, it indicates Gold Flash Overall for contact plating. –  Nowhere does the data sheet document the gold thickness

| https://www.eptac.com/wp-content/uploads/2016/04/eptac_04_20_16.pdf

What is the Correct Way to Fill Solder Cups - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/what-is-the-correct-way-to-fill-solder-cups

] or more of gold thickness A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly

What is the Correct Way to Fill Solder Cups - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/ask/what-is-the-correct-way-to-fill-solder-cups/

] or more of gold thickness A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly