Partner Websites: gold tin (Page 2 of 14)

Taiwan Fab Quote – Imagineering

Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-taiwan/

* Materials FR4(130Tg) FR4(170Tg) FR406(180Tg) Copper Weight 1 oz 2 oz 3 oz 4 oz Finish Plating ENIG1U" (Immersion Gold) ENIG2U" (Immersion Gold) ENIG3U" (Immersion Gold) ENIG4U" (Immersion Gold) ENIG5U" (Immersion Gold) Immersion Tin Immersion Silver HASL

Imagineering, Inc.

Assembly Quote – Imagineering

Imagineering, Inc. | https://www.pcbnet.com/quote/assembly-quote/?cpn=0

* Select One 1 2 3 4 5 6 8 Dimensions * Materials FR4(130Tg) FR4(170Tg) FR406(180Tg) Copper Weight 1 oz 2 oz 3 oz 4 oz Finish Plating ENIG1U" (Immersion Gold) ENIG2U" (Immersion Gold) ENIG3U" (Immersion Gold) ENIG4U" (Immersion Gold) ENIG5U" (Immersion Gold

Imagineering, Inc.

China Fab Quote – Imagineering

Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-china/

* Materials FR4(130Tg) FR4(170Tg) FR406(180Tg) Copper Weight 1 oz 2 oz 3 oz 4 oz Finish Plating ENIG1U" (Immersion Gold) ENIG2U" (Immersion Gold) ENIG3U" (Immersion Gold) ENIG4U" (Immersion Gold) ENIG5U" (Immersion Gold) Immersion Tin Immersion Silver HASL

Imagineering, Inc.

USA Fab Quote – Imagineering

Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-usa/

) LF HASL OSP ENIG2U"-5U" (Immersion Gold), Immersion Tin, Immersion Silver from Taiwan or China Minimum Trace/Space 0.005" 0.006" 0.007" 0.008" Testing No Yes SMD Side None Top Side Bottom Side Both Sides SMD Pitch N/A

Imagineering, Inc.

Intermetallic Growth on PCB-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?ID=te_news_bulletin,23575&url=_print

. During reflow, with the addition of tin-lead solders, the intermetallic grows. With other board metal finishes, other metallics form, such as AuSn when soldering components to boards with gold-flash finish (and tin-lead solder

USA Fab Quote – Imagineering

Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-usa/?cpn=2

) LF HASL OSP ENIG2U"-5U" (Immersion Gold), Immersion Tin, Immersion Silver from Taiwan or China Minimum Trace/Space 0.005" 0.006" 0.007" 0.008" Testing No Yes SMD Side None Top Side Bottom Side Both Sides SMD Pitch N/A

Imagineering, Inc.

USA Fab Quote – Imagineering

Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-usa/?cpn=5

) LF HASL OSP ENIG2U"-5U" (Immersion Gold), Immersion Tin, Immersion Silver from Taiwan or China Minimum Trace/Space 0.005" 0.006" 0.007" 0.008" Testing No Yes SMD Side None Top Side Bottom Side Both Sides SMD Pitch N/A

Imagineering, Inc.

USA Fab Quote – Imagineering

Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-usa/?cpn=3

(Leaded) ENIG2U"-5U" (Immersion Gold), Immersion Tin, Immersion Silver from Taiwan or China Minimum Trace/Space 0.007" 0.008" Testing No Yes SMD Side None Top Side Bottom Side Both Sides SMD Pitch N/A 0.025" over

Imagineering, Inc.

Intermetallic Growth on PCB-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23575.chtml

. During reflow, with the addition of tin-lead solders, the intermetallic grows. With other board metal finishes, other metallics form, such as AuSn when soldering components to boards with gold-flash finish (and tin-lead solder

Intermetallic Growth on PCB-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/te_news_bulletin/2021-08-31/23575.chtml

. During reflow, with the addition of tin-lead solders, the intermetallic grows. With other board metal finishes, other metallics form, such as AuSn when soldering components to boards with gold-flash finish (and tin-lead solder


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