| http://etasmt.com/cc?ID=te_news_bulletin,17761&url=_print
: according to the length of the heater, control the trajectory of the recirculation curve by controlling the speed of the conveyor belt 4, the cooling zone roll-off gradient is controlled by the
| https://www.eptac.com/faqs/ask-helena-leo/ask/problems-with-component-tombstone-on-flex-circuit
. If this helps, the laminate is flex kapton. Answer: Some of the reasons for tombstoning are related to solder paste quantity, land area sizes, solder mask between pads, thermal gradient between the two pads as some pads have a larger heat sinking
| https://www.eptac.com/ask/problems-with-component-tombstone-on-flex-circuit/
. If this helps, the laminate is flex kapton. Answer: Some of the reasons for tombstoning are related to solder paste quantity, land area sizes, solder mask between pads, thermal gradient between the two pads as some pads have a larger heat sinking
| http://etasmt.com:9060/te_news_bulletin/2020-04-23/15761.chtml
. Independence of temperature control in temperature range; 5. Protective welding function of inert gas; 6. Gradient control of the temperature drop in the cooling zone; 7
| http://etasmt.com:9060/te_news_bulletin/2020-07-06/17761.chtml
: according to the length of the heater, control the trajectory of the recirculation curve by controlling the speed of the conveyor belt 4, the cooling zone roll-off gradient is controlled by the
| http://etasmt.com/te_news_bulletin/2020-04-23/15761.chtml
. Independence of temperature control in temperature range; 5. Protective welding function of inert gas; 6. Gradient control of the temperature drop in the cooling zone; 7
| http://etasmt.com/te_news_bulletin/2020-07-06/17761.chtml
: according to the length of the heater, control the trajectory of the recirculation curve by controlling the speed of the conveyor belt 4, the cooling zone roll-off gradient is controlled by the
| http://etasmt.com/cc?ID=te_news_industry,24163&url=_print
. Generally, this phenomenon occurs at melting point or a temperature a little lower than the melting point. Rapid cooling leads to too high a temperature gradient between components and base-panels, causing mismatched thermal expansions and leading to solder joints’ and soldering pads
| http://etasmt.com:9060/te_news_industry/2021-09-01/24163.chtml
. Generally, this phenomenon occurs at melting point or a temperature a little lower than the melting point. Rapid cooling leads to too high a temperature gradient between components and base-panels, causing mismatched thermal expansions and leading to solder joints’ and soldering pads
| http://etasmt.com/te_news_industry/2021-09-01/24163.chtml
. Generally, this phenomenon occurs at melting point or a temperature a little lower than the melting point. Rapid cooling leads to too high a temperature gradient between components and base-panels, causing mismatched thermal expansions and leading to solder joints’ and soldering pads
