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: We are having a hard time with the removal of gold from hollow cup connectors. Using lead free solder, we are wicking the solder out with braid, but what is happening is that the pins are getting overheated and coming loose from the connector
| https://www.eptac.com/faqs/soldertips/soldertip/gold-removal-issues-with-hollow-cup-connectors
: We are having a hard time with the removal of gold from hollow cup connectors. Using lead free solder, we are wicking the solder out with braid, but what is happening is that the pins are getting overheated and coming loose from the connector
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Gold Wire Bond Failing Pull Test - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/ask/failing-to-remove-gold-plating-in-final-assembly/
Failing to Remove Gold Plating in Final Assembly - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/ask/j-std-001f-4-5-1-gold-removal-class-2-requirement-changed/
J-STD-001F 4.5.1 Gold Removal Class 2 Requirement Changed - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
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| http://etasmt.com/cc?ID=te_news_industry,26962&url=_print
. It has a wide range of uses and is a new type of environmental protection. product. 3. Soft and hard board: The birth and development of FPC and PCB gave birth to a new product of soft and hard board
| http://etasmt.com:9060/te_news_industry/2021-10-14/26962.chtml
. It has a wide range of uses and is a new type of environmental protection. product. 3. Soft and hard board: The birth and development of FPC and PCB gave birth to a new product of soft and hard board
| http://etasmt.com/te_news_industry/2021-10-14/26962.chtml
. It has a wide range of uses and is a new type of environmental protection. product. 3. Soft and hard board: The birth and development of FPC and PCB gave birth to a new product of soft and hard board
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