39 hasl sn/pb results

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 Sn/Pb paste and Sn/Pb components had the highest shear force  Both HASL and OSP finish had similar performance when subject to thermal shock regardless of paste and component termination finish in the solder joint. 14 Shear Tests

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"Lead-Free" Semiconductor Industry-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

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('lead' here refers to the external pins of the package for connecting the device to the outside world, and not the element Pb). Lead finish is the application of a layer of metal over the leads of the device to improve its solderability, protect it from corrosion and mechanical damage, and improve its appearance. Tin (Sn)-Lead (Pb

Surface Mount International

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. A total of six Pb-free alloys and a eutectic tin/lead (Sn-Pb) control alloy were included in the evaluation. Specifically, two binary eutectic and four ternary “near eutectic” Pb-free alloys were included. Each of the “alternative Pb-free alloys

Surface Mount Technology Association (SMTA)

"Lead-Free" Semiconductor Industry-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

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"Lead-Free" Semiconductor Industry-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

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:  Impact functionality  Impact reliability 5 Typical Metal Combinations to be Soldered  Cu to Cu  Cu to Sn/Pb  Pd to Sn/Pb  Au to Sn/Pb  Ag to Ag  Sn to Ni  SS to SS  SAC to Sn/Pb  ImAg to SAC  ImSn to Sn/Pb  ENIG to SAC & SnPb  Etc. 6 Flux Selection Process

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:  Impact functionality  Impact reliability 5 Typical Metal Combinations to be Soldered  Cu to Cu  Cu to Sn/Pb  Pd to Sn/Pb  Au to Sn/Pb  Ag to Ag  Sn to Ni  SS to SS  SAC to Sn/Pb  ImAg to SAC  ImSn to Sn/Pb  ENIG to SAC & SnPb  Etc. 6 Flux Selection Process

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. The most important phases are AuSn4 and AuSn2 intermetallic compound phases. •  The embrittlement is the result of a large volume fraction of hard Au-Sn IMC platelets in the ductile Sn-Pb matrix

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. • The embrittlement is the result of a large volume fraction of hard Au-Sn IMC platelets in the ductile Sn-Pb matrix. 12 Gold Embrittlement 13 Gold Embrittlement The data presented in these figures are from a theoretical calculation and have not been tested in practice but should be useful as a guide to avoiding

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Best Papers - Award Winners | SMTA International

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., Sandia National Laboratories "Sensitivity of Copper Dissolution to the Flow Behavior of Molten Sn-Pb Solder" 2013: Babak Arfaei, Ph.D., Universal Instruments Corporation "Effect of Sn Grain Morphology on Failure Mechanisms and the Reliability of Lead-Free Solder Joints in Thermal Cycling Tests" 2012

Surface Mount Technology Association (SMTA)