164 hole damage results

Will I Damage a Wire-In-Board if it is Bent Too Far - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/will-i-damage-a-wire-in-board-if-it-is-bent-too-far

Will I Damage a Wire-In-Board if it is Bent Too Far - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more

Solder Flow Near Through-Hole Component Body - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/solder-flow-near-through-hole-component-body

Solder Flow Near Through-Hole Component Body - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more

Solder Flow Near Through-Hole Component Body - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/ask/solder-flow-near-through-hole-component-body/

Solder Flow Near Through-Hole Component Body - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more

SolderTip #37: Through Hole Soldering of Thick PCBs - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/soldertip/soldertip-37-through-hole-soldering-of-thick-pcbs/

SolderTip #37: Through Hole Soldering of Thick PCBs - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more

SolderTip #37: Through Hole Soldering of Thick PCBs - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-37-through-hole-soldering-of-thick-pcbs

SolderTip #37: Through Hole Soldering of Thick PCBs - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more

What You Must Know About Moisture Sensitive Devices (MSDs)

Imagineering, Inc. | https://www.pcbnet.com/blog/everything-you-need-to-know-about-moisture-sensitive-devices-msds/

. Ball grid array and chip-scale packages are particularly sensitive to moisture damage. Surface-mount PCBs tend to absorb moisture more rapidly than through-hole PCBs

Imagineering, Inc.

) IPC-7711 "Rework of Electronic Assemblies" IPC-7721 "Repair & Modification of Printed Boards and Electronic Assemblies" Learn general requirements and practice damage-free removal and replacement techniques for wires and terminals, through-hole and surface mount components

| https://www.eptac.com/wp-content/uploads/2021/10/2022_Schedule_IPC-7711-7721_CIS.pdf

) IPC-7711 "Rework of Electronic Assemblies" IPC-7721 "Repair & Modification of Printed Boards and Electronic Assemblies" Learn general requirements and practice damage-free removal and replacement techniques for wires and terminals, through-hole and surface mount components

| https://www.eptac.com/wp-content/uploads/2022/02/2022_Schedule_IPC-7711-7721_CIS_02_08_22.pdf

IPC-A-610 Acceptable Requirements for Nicks and Chip-Outs - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/ipc-a-610-acceptable-requirements-for-nicks-and-chip-outs

: In IPC-A-610 section 9.4 on page 9-8 component damage there seems to be a lack of class three acceptable requirements for nicks or chip-outs in ceramic bodied components that are not in the termination area

EPTAC '05 Data Sheets

| https://www.eptac.com/wp-content/uploads/2021/10/EPTAC_DataSheet_610-CIT.pdf

• Component Damage and Printed Boards & Assemblies • Terminal Connections • Through-Hole Technology and Jumper Wires DAY 3 • Surface Mount Assemblies and Jumper Wires • Hardware DAY 4