| http://etasmt.com/te_news_bulletin/2021-08-31/23572.chtml
• Improper application of solder mask • Excessive slump of solder paste Reflow-related causes: • Improper reflow profile for solder paste
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23568.chtml
• Excessive solder paste slump after printing • Sphere size of solder paste too large for pitch components being soldered • Excessive moisture absorbed by solder paste
| http://etasmt.com/te_news_bulletin/2021-08-31/23568.chtml
• Excessive solder paste slump after printing • Sphere size of solder paste too large for pitch components being soldered • Excessive moisture absorbed by solder paste
| http://etasmt.com/te_news_bulletin/2019-08-05/9161.chtml
. In addition, if the viscosity of the solder paste is too low, and the solder paste slump is relatively poor, it is also a solder paste quality problem. (2
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
& Sealing Back Bonding & Sealing Bonding Gluing - Hot Melt Adhesive Gluing - Liquid Adhesive Sealing Soldering Coating Back Coating Coating - Conformal Coating - Container Coating - Fluid Coating - Hot Melt Adhesive Coating
| 1 |
