Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
referred to as the Weibull slope and is a measure of how tightly grouped the failures are. The higher the shape factor, the more uniform the reliability across the population is; if all components fail at exactly the same point the shape factor would be
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/smt
… [link through to Further Reading section at bottom of page ] Further Reading See how to find a range of hidden quality defects around BGA, QFN and SOT23 components, and through hole connectors
Imagineering, Inc. | https://www.pcbnet.com/blog/pcb-prototyping-what-you-should-be-looking-for/
. Prototyping is essential to ensure PCBs measure up to your precise specifications, but it can also prevent costly errors. Imagine the disaster of discovering PCB failure after full production
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/technical-experts/2d-x-ray-inspection
. Figure 9. Illustration of how the MAP technology can be used to measure precise Cu track thickness information. This can be used to generate thickness profiles (top right) or a full three dimensional representation of the copper thickness across the PCB
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