| https://www.eptac.com/faqs/ask-helena-leo/page/3
. J-STD-001, IPC-A-610 and IPC-A-620 all require solder to be “visible” in the inspection hole (if present). Is there a more specific requirement to this
. Can you explain what the “standard industry practice” is? Read Answer J-STD-001F 4.5.1 Gold Removal Class 2 Requirement Changed Question
ASCEN Technology | https://www.ascen.ltd/Blog/Solutio/602.html
-75µm thick (50µm typical) that ‘conforms’ to the circuit board topology. Its purpose is to protect electronic circuits from harsh environments that may contain high humidity, a range of airborne contaminants and varying temperatures
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. The minimum requirement is NEMA 3R although NEMA 4 steel and NEMA 4X non-metallic enclosures are more common. You’ll want to keep climate in mind
Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-tell-if-a-printed-circuit-board-is-bad/
isn’t the only thing that can damage printed circuit boards. Humidity can strongly influence board functionality during the assembly process, and conditions must be tightly regulated to ensure effective board design
55971 | https://www.ascen.ltd/ASCEN-smt-conveyor-list.pdf
ASCEN Technology
| https://www.eptac.com/wp-content/uploads/2015/03/ecss_q_st_70_18c-space-product-assurance-rf-coax-cables.pdf
part of this Standard is based on industrial experience and recommendations from European soldering technology experts. Modifications are incorporated into the text to provide for the specific requirement of low‐outgassing
Surface Mount Technology Association (SMTA) | https://www.smta.org/news/smta_calendar/calendar.cfm
webinar All webinar times shown are UK time – to check your local time in your countries click here Export to Calendar Outlook iCal Google August 18 Webinar: How to Minimize Humidity Interaction with PCBAs for Robustness + Free for Members! Tuesday
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
] that the immersion silver surface finish selected for lead-free PCBs had the susceptibility to creep corrode when used in high sulfur and high humidity environments