ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/wafer-x-ray-metrology/xm8000-wafer-x-ray-metrology-platform
, 2.5D and 3D IC packages, MEMS and wafer bumps. The XM8000 provides unprecedented, non-destructive, in-line wafer measurement of voiding and fill levels, overlay, critical dimensions and much more
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/nordson-dage-launches-the-xm8000-wafer-x-ray-metrology-platform
, 2.5D and 3D IC packages, MEMS and wafer bumps. The XM8000 provides unprecedented, non-destructive, in-line wafer measurement of voiding and fill levels, overlay, critical dimensions and much more
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/nordson-dage-to-launch-new-4800-wafer-level-bondtester-at-semicon-west
, 2.5D and 3D IC packages, MEMS and wafer bumps. It provides unprecedented, non-destructive, in-line wafer measurement of voiding and fill levels, overlay and critical dimensions
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/products/fluid-dispensing-systems/tilt-dispensing
. Tilt jetting can also improve capillary underfill for 3D IC packages by reducing wet-out distance from the die edge and ensuring sufficient underfill at the top layer of the die stack
Surface Mount Technology Association (SMTA) | https://www.smta.org/iceet/keynote.cfm
: Recent Japanese Developments, co-author of How to Make IC Packages (published in Japanese by Nikkan Kogyo Shinbun), a columnist with Circuits Assembly Magazine, and the author of numerous publications on emerging trends in semiconductor packaging and assembly
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/inspection-leader-nordson-dage-earns-its-20th-award-at-productronica
, 2.5D and 3D IC packages, MEMS and wafer bumps. Mark Flain, Business Director – X-ray Systems commented, “The XM8000 Platform illustrates Nordson
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/ja-JP/divisions/dage/about/news/inspection-leader-nordson-dage-earns-its-20th-award-at-productronica
, 2.5D and 3D IC packages, MEMS and wafer bumps. Mark Flain, Business Director – X-ray Systems commented, “The XM8000 Platform illustrates Nordson
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/about-us/news/nordson-asymtek-tilt-rotate-uses-5-axes-for-fluid-dispensing
; and dispenses into tight corners and narrow gaps in advanced packages. For 3D IC applications, applying fluid for capillary underfill of stacked die using conventional vertical dispensing necessitates building up fluid to reach the top of the stack
| https://unisoft-cim.com/manual-pronto-detail_mount-file-window.htm
: The left side box in this field indicates the zero degrees rotation for IC type packages 4 pins or greater (also 3 pin in-line packages
FKN Systek | http://fknsystek.com/Tools%20for%20Assembly.htm
ASSEMBLY TOOLS Component Cutoff Saw - PGA Inserters - IC Lead Straighteners Tools for Electronics Assembly 03-001CS Component Cutoff Saw The component cutoff saw can be set up to cut various sizes of headers. An adjustable stop
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