Partner Websites: imm tin vs tin plating (Page 1 of 3)

SolderTips: Gold Removal and Wave Soldering vs Hand Soldering | EPTAC

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SolderTips: Gold Removal and Wave Soldering vs Hand Soldering | EPTAC Skip to content Scroll Toll Free: 800.643.7822 Toggle navigation Training All Classes

Wet Sponge Cleaning vs. Dry Brass Sponge Cleaning - EPTAC - Train. Work Smarter. Succeed

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. This cracking allowed the tin to penetrate the plating on the tip, which prevented the tip from being tinned, thereby increasing the oxidation on the tip, rendering the tip useless and needing to be replaced

SolderTips: Gold Removal and Wave Soldering vs Hand Soldering - EPTAC - Train. Work Smarter. Succeed

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SolderTips: Gold Removal and Wave Soldering vs Hand Soldering - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more

SolderTips: Gold Removal and Wave Soldering vs Hand Soldering - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering

SolderTips: Gold Removal and Wave Soldering vs Hand Soldering - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more

SolderTips: Solderability Issues with Nickle Plated Surfaces - EPTAC - Train. Work Smarter. Succeed

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: We are working with components with leads of tin/lead over nickel. After the manufacturing processes, some of the pins are exhibiting what appears to be flaking plating, leaving behind unsolderable surfaces

SolderTips: Dealing with the Problems of Soldering Iron Tips Breaking Down - EPTAC - Train. Work Sma

| https://www.eptac.com/soldertip/soldertips-dealing-with-the-problems-of-soldering-iron-tips-breaking-down/

. We are soldering lead free materials between 600 and 700 degrees F and increasing the contact dwell time by about 1 to 1.5 seconds. The new lead free alloys are high in tin content and the tin will dissolve the plating on the solder iron tip and eventually eat through the tip

Ask Questions | EPTAC

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. Read Answer Maximum Limits of Solder Bath Contamination Question: If we are using a solder pot to tin wires and create solder joints (splices

Soldertips

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: We are working with components with leads of tin/lead over nickel. After the manufacturing processes, some of the pins are exhibiting what appears to be flaking plating, leaving behind unsolderable surfaces

Soldertips

| https://www.eptac.com/faqs/soldertips

: We are working with components with leads of tin/lead over nickel. After the manufacturing processes, some of the pins are exhibiting what appears to be flaking plating, leaving behind unsolderable surfaces

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