Imagineering, Inc. | https://www.pcbnet.com/blog/identifying-and-correcting-solder-bridge-defects/
. Unfortunately, there are numerous causes that can produce solder bridging. To produce as quickly and efficiently as possible, finding the root cause of this defect is critical
Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-prevent-a-solder-ball-defect/
. However, this type of removal is not effective when the root cause stems from misprinted PCBs and pre-reflow solder paste issues. As a result, it is best to diagnose the cause of solder balls as early as possible, as these processes can negatively influence your PCB manufacturing and production
| https://www.eptac.com/blog/5-common-solder-mistakes-and-how-to-resolve-them
. 4. Cold Solder Joint A cold solder joint occurs when the solder does not melt completely. A result of insufficient heat, cold joints are often characterized by being rigid, rough, and uneven in appearance
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
. The root cause of voids in solder joints is understood and has been documented in numerous publications on the topic [1-3]. There are industry guidelines for characterizing voiding [4, 5
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
. The root cause of voids in solder joints is understood and has been documented in numerous publications on the topic [1-3]. There are industry guidelines for characterizing voiding [4, 5
| https://www.eptac.com/soldertip/solder-pot-maintenance-and-dross-removal/
. Does turning up the solder pot too high cause impurities to collect on parts? Can you comment on this? More SolderTips SolderTip #36: Wave Soldering Insufficient Fill and Voids in PTH SolderTip
| https://www.eptac.com/soldertip/accept-or-reject-solder-contacting-component-bodies/
. When solder touches the body of a component, be it either PTH or SMT components, there is a possibility that it can destroy the seal where the lead enters the component body and cause issues in the
| http://etasmt.com/cc?ID=te_news_bulletin,21161&url=_print
cause the circuit board to be burnt. 4. The role of SMT reflow oven cooling zone At this stage, the temperature is cooled to below the solid phase temperature to solidify the solder joints
Surface Mount Technology Association (SMTA) | https://www.smta.org/news/smta_calendar/calendar.cfm
Time (9:30am - 11:00am US Eastern Time) Presenter: Stefan Strixner, ZESTRON Europe Free for members! Overview In case of malfunctions of electrical assemblies in the field a proper failure analysis to identiy its root cause and define future avoiding
| http://etasmt.com:9060/te_news_bulletin/2020-12-11/21161.chtml
cause the circuit board to be burnt. 4. The role of SMT reflow oven cooling zone At this stage, the temperature is cooled to below the solid phase temperature to solidify the solder joints
