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Solder Touching Glass Body Components Like Diodes - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/ask/solder-touching-glass-body-components-like-diodes/

the sides and the bottom of the component end cap diameter. An example of this can be seen in Figure 8-58 and 8-59 of the IPC-A-610 document

Air Bubbles or Voids in Solder Joints - EPTAC - Train. Work Smarter. Succeed

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. The only documents that discuss this from an IPC perspective are IPC-A-610 in section 8.3.12 Surface Mount Area Array, IPC-7093 – Design and Assembly Process Implementation for Bottom Termination Components and IPC-7095C

Air Bubbles or Voids in Solder Joints - EPTAC - Train. Work Smarter. Succeed

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. The only documents that discuss this from an IPC perspective are IPC-A-610 in section 8.3.12 Surface Mount Area Array, IPC-7093 – Design and Assembly Process Implementation for Bottom Termination Components and IPC-7095C

S3016 ultra

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. Technical Specifications S3016 ultra Inspection scope 3D AOI Selective and wave soldering, standard solder joints according to IPC, press fit Camera technology 3D camera technology Z-resolution 0.5

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