Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
(Note that in SnPb solder joint, Cu6Sn5 present at the interface between SnPb solder and the Cu pad) and Ag3Cu intermetallic compound (IMC
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf
(Note that in SnPb solder joint, Cu6Sn5 present at the interface between SnPb solder and the Cu pad) and Ag3Cu intermetallic compound (IMC
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
. High Temperature Alloy Refers to a solder alloy with a solidus temperature above 230° C (446° F). See Solidus . Hygroscopic The capacity of a material or compound to absorb and retain moisture from its environment
Surface Mount Technology Association (SMTA) | https://www.smta.org/webinars/
: Systematic Failure Analysis Webinar Jul 9, 2020 Creating the Best Data Package for PCB Fabrication Jul 14, 2020 Practical Guidelines in Handling Moisture Sensitive Packages and PWBs Jul 16, 2020 So
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
. High Temperature Alloy Refers to a solder alloy with a solidus temperature above 230° C (446° F). See Solidus . Hygroscopic The capacity of a material or compound to absorb and retain moisture from its environment
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
PLATED FR-4 PRINTED CIRCUIT BOARDS Elissa Bumiller et al. Abstract 17-2 TERNARY INTERMETALLIC COMPOUND - A REAL THREAT TO BGA SOLDER JOINT RELIABILITY Shelgon Yee, Ph. D., et al. Abstract 17-1 A COMPARISON BETWEEN POWER AND THERMAL CYCLING FOR A FC PBGA
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined
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