Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
. Statistical T-Test for Solder Joint Voiding Showing Indistinguishable Failure Populations [7] Study #4: S. Sethuraman et al, “The Effect of Process Voiding on BGA Solder Joint Fatigue Life Measured in Accelerated Temperature Cycling” [8
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
provided after the webinar All webinar times shown are UK time – to check your local time in your countries click here Registrations are being taken through the SMTA Online Registration System. Webinar: Europe Chapter: Systematic Failure Analysis Webinar
Surface Mount Technology Association (SMTA) | https://www.smta.org/webinars/
: Systematic Failure Analysis Webinar Jul 9, 2020 Creating the Best Data Package for PCB Fabrication Jul 14, 2020 Practical Guidelines in Handling Moisture Sensitive Packages and PWBs Jul 16, 2020 So
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
solder ball attach for BGA) on TIMs voiding. Fig. 8 below shows an x-ray result after sTIM reflow, then after subsequent SAC reflow (details later). Fig. 8: Reflow#1 vs. Reflow#2 – same part In the case of Heller Industries, the task was to establish the
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