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Subscribe Blog Nordson EFD Home Resource Center Solder Dictionary of Terms Solder Dictionary of Terms A B C D E F G H I J K L M N O P Q R S T U V W X Y Z A Activator The chemically reactive portion of a Flux
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| https://www.eptac.com/soldertips/soldertips-issues-with-incomplete-solder-reflow-in-production-2/
. Is the incomplete reflow of solder paste as per Section 5.2.3 of IPC-A-610 a defect requiring rework even if the fillet appears to meet IPC standards? Answer
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
APEX 2006, S31-03-01 to S31-03-10. [12] D. R. Banks, T. E. Burnette, Y. Cho, W. T. DeMarco, and A. J. Mawer, “Effect of Solder Joint Voiding on Plastic To be published in the Proceedings of SMTA International, September 17 - 21, 2016, Rosemont, IL. Ball
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
APEX 2006, S31-03-01 to S31-03-10. [12] D. R. Banks, T. E. Burnette, Y. Cho, W. T. DeMarco, and A. J. Mawer, “Effect of Solder Joint Voiding on Plastic To be published in the Proceedings of SMTA International, September 17 - 21, 2016, Rosemont, IL. Ball
| https://www.eptac.com/blog/ipc-whma-a-620-revision-a-to-b-redline-document-comparison
: Helena Pasquito, Gary Ferrari and Leo Lambert Read More Blog EPTAC Corporation Releases IPC-A-610 and J-STD-001 Revision D to E Comparison Clinic Attend the IPC-A-610
| https://www.eptac.com/soldertip/soldertips-issues-with-incomplete-solder-reflow-in-production-2/
becoming totally molten and coalesce forming a homogeneous molten solder volume. If the solder paste appears to not have reflowed and is as identified in IPC-A-610 section 5, the issue is that the proper intermetallic has not formed at both the component and pad/land surface
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-issues-with-incomplete-solder-reflow-in-production-2
becoming totally molten and coalesce forming a homogeneous molten solder volume. If the solder paste appears to not have reflowed and is as identified in IPC-A-610 section 5, the issue is that the proper intermetallic has not formed at both the component and pad/land surface
| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-43-ipc-j-std-001-rev-e-instructor-training-materials
. E Instructor Training Materials Question: We have been conducting operator training for both J-STD-001 and IPC-A-610 to the Revision D documents
| https://www.eptac.com/are-voids-in-solder-joints-really-an-issue/
? Posted on 5th June, 2012 by Mark Pilkington Recent Articles IoT and the Aerospace Industry – Too Risky? Leaded vs. Lead-Free Solder: Which is Better? The 5 Essential Tools for Soldering The Importance of IPC-A-610 Certification How to Build on Your Career in Soldering Categories Blog Uncategorized Why Get IPC Certified Well
IPC is the trade association for the printed wiring board and electronics assembly industries.
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