| https://www.eptac.com/soldertips/soldertips-issues-with-incomplete-solder-reflow-in-production-2/
. Is the incomplete reflow of solder paste as per Section 5.2.3 of IPC-A-610 a defect requiring rework even if the fillet appears to meet IPC standards? Answer
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
APEX 2006, S31-03-01 to S31-03-10. [12] D. R. Banks, T. E. Burnette, Y. Cho, W. T. DeMarco, and A. J. Mawer, “Effect of Solder Joint Voiding on Plastic To be published in the Proceedings of SMTA International, September 17 - 21, 2016, Rosemont, IL. Ball
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
APEX 2006, S31-03-01 to S31-03-10. [12] D. R. Banks, T. E. Burnette, Y. Cho, W. T. DeMarco, and A. J. Mawer, “Effect of Solder Joint Voiding on Plastic To be published in the Proceedings of SMTA International, September 17 - 21, 2016, Rosemont, IL. Ball
| https://www.eptac.com/blog/ipc-whma-a-620-revision-a-to-b-redline-document-comparison
: Helena Pasquito, Gary Ferrari and Leo Lambert Read More Blog EPTAC Corporation Releases IPC-A-610 and J-STD-001 Revision D to E Comparison Clinic Attend the IPC-A-610
| https://www.eptac.com/soldertip/soldertips-issues-with-incomplete-solder-reflow-in-production-2/
becoming totally molten and coalesce forming a homogeneous molten solder volume. If the solder paste appears to not have reflowed and is as identified in IPC-A-610 section 5, the issue is that the proper intermetallic has not formed at both the component and pad/land surface
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-issues-with-incomplete-solder-reflow-in-production-2
becoming totally molten and coalesce forming a homogeneous molten solder volume. If the solder paste appears to not have reflowed and is as identified in IPC-A-610 section 5, the issue is that the proper intermetallic has not formed at both the component and pad/land surface
| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-43-ipc-j-std-001-rev-e-instructor-training-materials
. E Instructor Training Materials Question: We have been conducting operator training for both J-STD-001 and IPC-A-610 to the Revision D documents
| https://www.eptac.com/are-voids-in-solder-joints-really-an-issue/
? Posted on 5th June, 2012 by Mark Pilkington Recent Articles IoT and the Aerospace Industry – Too Risky? Leaded vs. Lead-Free Solder: Which is Better? The 5 Essential Tools for Soldering The Importance of IPC-A-610 Certification How to Build on Your Career in Soldering Categories Blog Uncategorized Why Get IPC Certified Well
| https://www.eptac.com/soldertip/soldertip-43-ipc-j-std-001-rev-e-instructor-training-materials/
: We have been conducting operator training for both J-STD-001 and IPC-A-610 to the Revision D documents. Can you tell me when the training materials will be available for Revision E and if I have to retrain everyone to the new revision? Answer
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
solder ball attach for BGA) on TIMs voiding. Fig. 8 below shows an x-ray result after sTIM reflow, then after subsequent SAC reflow (details later). Fig. 8: Reflow#1 vs. Reflow#2 – same part In the case of Heller Industries, the task was to establish the
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