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) Inspection Methods Microvia Interface Failures Process Control Reliability after Repair or Rework Surface Reliability Test Method Developments Tin Whiskers Other… Enter other

Optimizing Reflowed Solder TIM (sTIMs) Processes for Emerging Heterogeneous Integrated Packages

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/atmosphere), preform thickness, flux %, test vehicle, metallization and surface cleanliness – among potential others. The initial DOE is summarized in Table 1. Table 1: Description of input and control variables in initial DOE B. Test Method and Materials All

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Association Connecting Electronics Industries (IPC)
Association Connecting Electronics Industries (IPC)

IPC is the trade association for the printed wiring board and electronics assembly industries.

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