| https://www.eptac.com/ask/air-bubbles-or-voids-in-solder-joints/
: We did some cross sectioning of solder joints on a PCB assembly and found some air bubbles trapped in the solder joints. Do you know if there is an IPC standard to specify the maximum allowable air bubbles or voids in a solder joint
| https://www.feedersupplier.com/sale-13119135-juki-ke-2080l-ipc-9850-flexible-juki-smt-chip-mounter.html
JUKI KE-2080L IPC 9850 Flexible JUKI SMT Chip Mounter Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
| http://www.feedersupplier.com/sale-13119135-juki-ke-2080l-ipc-9850-flexible-juki-smt-chip-mounter.html
JUKI KE-2080L IPC 9850 Flexible JUKI SMT Chip Mounter Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
| https://www.eptac.com/congrats-to-helena-pasquito-2014-ipc-recognition-award/
– 2014 IPC Recognition Award Posted on 30th January, 2014 by Leo Lambert Recent Articles IoT and the Aerospace Industry – Too Risky? Leaded vs. Lead-Free Solder: Which is Better? The 5 Essential Tools for Soldering The Importance of IPC-A-610 Certification How to Build on Your Career in Soldering Categories Blog Uncategorized Why Get IPC Certified Helena Pasquito - EPTAC's
| https://www.eptac.com/blog/navigating-the-world-of-electronics-standards
Navigating the World of Electronics Standards: Why IPC Stands Out Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/webinar/addressing-the-issues-around-solder-joint-voids-in-surface-mount-components/
Why Get IPC Certified Blog FAQ’s Upcoming Webinars Archived Webinars About Instructors Consulting Services Press Releases Careers Contact Us Addressing the Issues Around Solder Joint Voids in Surface Mount Components Yes, we are
| https://www.eptac.com/soldertip/soldertips-issues-with-incomplete-solder-reflow-in-production-2/
becoming totally molten and coalesce forming a homogeneous molten solder volume. If the solder paste appears to not have reflowed and is as identified in IPC-A-610 section 5, the issue is that the proper intermetallic has not formed at both the component and pad/land surface
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-issues-with-incomplete-solder-reflow-in-production-2
becoming totally molten and coalesce forming a homogeneous molten solder volume. If the solder paste appears to not have reflowed and is as identified in IPC-A-610 section 5, the issue is that the proper intermetallic has not formed at both the component and pad/land surface
| https://www.eptac.com/3-benefits-of-ipc-certification-in-electronic-assemblies-inspection/
& Inspection Posted on 14th December, 2017 by Leo Lambert Recent Articles IoT and the Aerospace Industry – Too Risky? Leaded vs. Lead-Free Solder: Which is Better? The 5 Essential Tools for Soldering The Importance of IPC-A-610 Certification How to Build on Your Career in Soldering Categories Blog Uncategorized Why Get IPC Certified As an emerging OEM/EMS
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc2221-2222-and-throughhole-pad-stacks_topic2586_post10872.html
Patterns as shown below. There are not many IPC-610 Fabrication rules for Surface Mount Technology. Minimum pad to pad & solder mask swell for registration might apply
