ORION Industries | http://orionindustries.com/pdfs/300lse.pdf
) Application Techniques: For maximum bond strength, the surface should be thoroughly cleaned and dried. Typical cleaning solvents are heptane or isopropyl alcohol
| https://www.eptac.com/blog/5-common-solder-mistakes-and-how-to-resolve-them
you’re faced with an overheated joint, you’ll need to remove the burnt flux so it looks right. You can scrape it off with the tip of a PCB tool, or you may need to use a solution like isopropyl alcohol on a toothbrush to get the job done. Q
Imagineering, Inc. | https://www.pcbnet.com/blog/5-signs-your-pcb-may-need-to-be-repaired-or-replaced/
. Dealing with Corrosion and Environmental Damage Physically damaged components can be desoldered and replaced with new ones. Some corrosion can be cleaned with isopropyl alcohol or a specialized cleaning solution
ORION Industries | http://orionindustries.com/pdfs/200mp.pdf
maximum bond strength (during installation of the final part) the surface should be thoroughly cleaned and dried. Typical cleaning solvents are heptane* (for oily surfaces) or isopropyl alcohol* for plastics. Use reagent grade solvents since common
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