| https://www.eptac.com/webinars/understanding-solderability-testing-for-printed-circuit-boards-and-components/
FAQ’s About Us Instructors Consulting Services Customized Training Press Releases Careers Contact WEBINARS Understanding Solderability Testing for Printed Circuit Boards and Components J-STD-002
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_05_20_09.pdf
5-23 Solderability Subcommittee 5-24 Assembly & Joining Subcommittee 5-25 Opto-Electronics Assembly Subcommittee 6 List of Documents Controlled by 5-20 Committee IPC-7095 J-STD-032 J-STD-013 5-21f IPC-75255-21e IPC-9503 now J-STD-075 under B-10a IPC-9501, 2, 4 5-21c
| https://www.eptac.com/webinars/page/5
: 34 Minutes J-STD-002 “Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires” and J-STD-003 “Solderability Tests for Printed Boards
| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-removal-on-bottom-only-smt-rf-components
“bottom only” and the castellations are gold. Is there anything we can do about the 75% gold removal rule? Answer: If you check J-STD-002, you will see the methods to check for solderability of those components
| https://www.eptac.com/faqs/ask-helena-leo/ask/wave-solder-machine-flux-system-testing-on-a-budget
. I would also strongly suggest reviewing J-STD-002 and J-STD-003 for the solderability test for wires, terminals and boards. It is imperative this is done to make sure