Blackfox Training Institute, LLC | https://www.blackfox.com/everything-you-need-to-know-about-esd-management/
: catastrophic and latent failure. Catastrophic failure is the more visible type of static damage, like melting or explosion, both of which immediately damages a device’s circuitry
| https://www.eptac.com/soldertip/accept-or-reject-solder-contacting-component-bodies/
component by allowing moisture to enter resulting in latent failures, basically failures in the field. The same criteria applies to surface mount components as is stated in the notes beneath Tables 8-5 and 8-6 in the surface mount section of IPC-A-610
| https://www.eptac.com/faqs/soldertips/soldertip/accept-or-reject-solder-contacting-component-bodies
component by allowing moisture to enter resulting in latent failures, basically failures in the field. The same criteria applies to surface mount components as is stated in the notes beneath Tables 8-5 and 8-6 in the surface mount section of IPC-A-610
Blackfox Training Institute, LLC | https://www.blackfox.com/blog/everything-you-need-to-know-about-esd-management/
: catastrophic and latent failure. Catastrophic failure is the more visible type of static damage, like melting or explosion, both of which immediately damages a device’s circuitry
| https://www.eptac.com/faqs/ask-helena-leo/ask/solder-flow-near-through-hole-component-body
create latent failures at a later point in time. The same requirements apply to the surface mount component and this is stated as a note beneath all the table in the surface mount section of IPC-A-610
| https://www.eptac.com/ask/solder-flow-near-through-hole-component-body/
create latent failures at a later point in time. The same requirements apply to the surface mount component and this is stated as a note beneath all the table in the surface mount section of IPC-A-610
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/smt
. For applications where the BGA may be subjected to regular shocks (for example in a mobile phone) mechanical pull and shear testing ensures adhesion strength is acceptable and protects against future latent failures. More information
| https://www.eptac.com/faqs/ask-helena-leo/ask/solder-touching-glass-body-components-like-diodes
glass bodied components. The hot solder touching the glass body will cause a shock to the glass, potential causing the glass to crack or craze, which would cause a latent failure of the component
| https://www.eptac.com/ask/solder-touching-glass-body-components-like-diodes/
glass bodied components. The hot solder touching the glass body will cause a shock to the glass, potential causing the glass to crack or craze, which would cause a latent failure of the component
