| https://www.eptac.com/soldertips/accept-or-reject-solder-contacting-component-bodies/
. The reason being is that if the solder does touch the body it will reduce or eliminate the stress relief characteristic of the leads, which can cause physical component damage and failures, either
| https://www.eptac.com/blog/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal
. J-STD-001 Revision “E” stated: 4.5.1 Gold Removal Gold shall be removed: a. From at least 95% of the surfaces to be soldered of the through-hole component leads with 2.54 μm [100 μin
| https://www.eptac.com/faqs/ask-helena-leo/ask/failing-to-remove-gold-plating-in-final-assembly
. There is no requirement to remove this gold plating prior to soldering. The only requirement for the removal of gold is for component leads and terminals which will be soldered to the printed circuit board itself
| https://www.eptac.com/ask/failing-to-remove-gold-plating-in-final-assembly/
. There is no requirement to remove this gold plating prior to soldering. The only requirement for the removal of gold is for component leads and terminals which will be soldered to the printed circuit board itself
| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001e-2010-4-5-1-gold-removal-issues
? Does this mean we should remove the ICs from their tape and reel packaging, tin the leads for proper gold removal, then re-reel the parts for proper packaging for pick and place equipment
| https://www.eptac.com/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/
: Soldering gold parts onto printed circuit boards follows Paragraph 4.5.1 Gold Removal in J-STD-001 as you had mentioned. The gold has to be removed from component leads whose gold thickness exceeds
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering
: Soldering gold parts onto printed circuit boards follows Paragraph 4.5.1 Gold Removal in J-STD-001 as you had mentioned. The gold has to be removed from component leads whose gold thickness exceeds
| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/
. J-STD-001 Revision “E” stated: 4.5.1 Gold Removal Gold shall be removed: a. From at least 95% of the surfaces to be soldered of the through-hole component leads with 2.54 μm [100 μin
| https://www.eptac.com/faqs/soldertips/soldertip/accept-or-reject-solder-contacting-component-bodies
. The reason being is that if the solder does touch the body it will reduce or eliminate the stress relief characteristic of the leads, which can cause physical component damage and failures, either
